Methods for Integrating a Compliant Material with a Substrate

• US 20170060290A1
• Filed: 08/28/2015
• Published: 03/02/2017
• Est. Priority Date: 08/28/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Chen, Hui, Chen, Po-Jui, Sung, Kuo-Hua
• Granted Patent: US 10,101,857 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0447 Position sensing using the local deformation of sensor cells
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches
• CPC Class Codes: H03K 2217/960765 Details of shielding arrangements
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.

Claims

1. A method for forming a sensor module, comprising:

providing a compliant structure that includes a compliant layer;

constructing a first substrate layer over a first surface of the compliant structure, wherein the first substrate layer includes a first conductive layer; and

producing a first substrate tail from a portion of the first substrate layer.

2. The method of claim 1, wherein the compliant structure comprises:

a first protective layer positioned over a first surface of the compliant layer; and

a second conductive layer positioned between the first protective layer and the first substrate layer, wherein the second conductive layer electrically connects to the first conductive layer.

3. The method of claim 2, further comprising:

forming a second substrate layer over a second surface of the compliant structure, wherein the second substrate layer includes a third conductive layer; and

producing a second substrate tail from a portion of the second substrate layer.

4. The method of claim 3, wherein the compliant structure comprises:

a second protective layer positioned over a second surface of the compliant layer; and

a fourth conductive layer positioned between the first protective layer and the second substrate layer, wherein the third conductive layer electrically connects to the third conductive layer.

5. The method of claim 4, wherein producing first and second substrate tails from a portion of the first and second substrate layers comprises:

removing a portion of the compliant structure; and

removing a portion of each substrate layer.

6. The method of claim 4, wherein the first substrate layer comprises a first flexible printed circuit, the second substrate layer comprises a second flexible printed circuit, and the compliant layer comprises a silicone layer.

7. The method of claim 6, wherein the first conductive layer and the third conductive layer each comprise one or more conductive electrodes, wherein each conductive electrode in the first conductive layer is aligned with a respective electrode in the second conductive layer to form a capacitor.

8. The method of claim 1, wherein forming the first substrate layer over the first surface of the compliant structure comprises:

forming a first layer in the first substrate layer over the first surface of the compliant structure; and

forming a second layer in the first substrate layer over the first layer.

9. A method for forming a sensor module, comprising:

providing a first substrate layer and a second substrate layer, wherein the first and second substrate layers each include one or more electrical components and the first and second substrate layers are separated from each other by a gap;

providing a spacer element in the gap between the first and second substrate layers, wherein the spacer element fills only a portion of the gap between the first and second substrate layers;

injecting a compliant material into the portion of the gap that does not include the spacer element; and

removing the spacer element to produce a first substrate tail from a portion of the first substrate layer and a second substrate tail from a portion of the second substrate layer.

10. The method of claim 9, wherein the first substrate layer comprises a first flexible printed circuit, the second substrate layer comprises a second flexible printed circuit, and the compliant layer comprises a silicone layer.

11. The method of claim 10, wherein the first and second flexible printed circuits each comprise one or more conductive electrodes, and wherein each conductive electrode in the first flexible printed circuit is aligned with a respective electrode in the second flexible printed circuit to form a capacitor.

12. A method for forming a sensor module, comprising:

providing a first substrate layer that includes one or more electrical components;

providing a compliant structure that includes a compliant layer;

attaching the first substrate layer to a first surface of the compliant structure; and

producing a first substrate tail from a portion of the first substrate layer.

13. The method of claim 12, further comprising:

providing a second substrate layer that includes one or more electrical components;

attaching the second substrate layer to a second surface of the compliant structure; and

producing a second substrate tail from a portion of the second substrate layer.

14. The method of claim 13, wherein producing first and second substrate tails from a portion of the first and second substrate layers comprises:

removing a portion of the compliant structure; and

removing a portion of at least one layer in each substrate layer.

15. The method of claim 14, wherein the first substrate layer comprises a first flexible printed circuit, the second substrate layer comprises a second flexible printed circuit, and the compliant layer comprises a silicone layer.

16. The method of claim 15, wherein the one or more electrical components in the first and second flexible printed circuits comprise one or more conductive electrodes, wherein each conductive electrode in the first flexible printed circuit is aligned with a respective electrode in the second flexible printed circuit to form a capacitor.

17. A method of forming multiple sensor modules, comprising:

forming a sheet of a sensor structure, wherein the sheet of the sensor structure is used to form the multiple sensor modules;

forming a plurality of substrate tails in the sheet of the sensor structure by removing portions of the sensor structure, wherein at least one substrate tail is associated with each sensor module to be formed;

attaching a conductive structure to the at least one substrate tail associated with each sensor module to be formed;

attaching an adhesive layer to at least one surface of the sheet of the sensor structure;

forming an opening in a portion of the sheet of the sensor structure for each sensor module to be formed; and

singulating the sheet of the sensor structure to produce each sensor module in the multiple sensor modules.

18. The method of claim 17, further comprising attaching a liner layer to a surface of the sheet of the sensor structure prior to singulating the sheet of the sensor structure, wherein the liner layer includes a liner for each sensor module.

19. The method of claim 17, wherein attaching an adhesive layer to at least one surface of the sheet of the sensor structure comprises:

attaching a first adhesive layer to a first surface of the sheet of the sensor structure; and

attaching a second adhesive layer to a second surface of the sheet of the sensor structure.

20. The method of claim 17, wherein forming the opening in the portion of the sheet of the sensor structure for each sensor module to be formed comprises forming an opening in a portion of the sheet of the sensor structure for each sensor module to be formed such that the at least one substrate tail associated with each sensor module extends into the opening of the sensor module.

21. The method of claim 17, wherein the sheet of the sensor structure comprises a compliant structure positioned between a first substrate layer and a second substrate layer.

22. The method of claim 21, wherein the first and second substrate layers each comprise a flexible printed circuit.

23. The method of claim 22, wherein the at least one substrate tail associated with each sensor module to be formed comprises a first substrate tail and a second substrate tail, the first and second substrate tails each comprising flexible printed circuit tails, and the conductive structure is attached to an end of the first and second flexible printed circuit tails.

24. The method of claim 23, wherein the conductive structure comprises an interposer flexible circuit.