Low-Dust Products Using Microcrystalline Wax Emulsion

• US 20170088751A1
• Filed: 09/23/2016
• Published: 03/30/2017
• Est. Priority Date: 09/24/2015
• Status: Active Grant

• Current Assignee: Henry Company LLC (Carlisle Cos., Inc.)
• Original Assignee: Henry Company LLC (Carlisle Cos., Inc.)
• Inventors: Ayambem, Amba
• Granted Patent: US 10,370,566 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 2607/00 Walls, panels
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: C08K 5/01 Hydrocarbons C08K5/0091 takes precedence
• CPC Class Codes: C09D 5/34 Filling pastes materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12
• CPC Class Codes: C09J 11/06 organic
• CPC Class Codes: C09J 11/08 Macromolecular additives
• CPC Class Codes: C09J 129/04 Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: C09J 9/00 Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks C09J7/00 takes precedence
• CPC Class Codes: C09K 3/10 Materials in mouldable or extrudable form for sealing or packing joints or covers filling pastes C09D5/34
• CPC Class Codes: C09K 3/22 for dust-laying or dust-absorbing

Abstract

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.

Claims

1. A low-dust joint compound composition comprising:

(i) a dust reduction additive emulsion comprising colloidally-protected microcrystalline-wax-based (CMWB) microstructures; and

(ii) a first water.

2. The low-dust joint compound composition as recited in claim 1, wherein said dust reduction additive emulsion comprises said CMWB microstructure comprising:

(A) a wax core,

wherein said wax core comprises a microcrystalline-wax component and a non-microcrystalline-wax component,

wherein said microcrystalline-wax component comprises at least one linear alkane wax defined by the general formula C_nH₂₊₂, where n ranges from 13-80,

wherein said non-microcrystalline-wax component comprises at least one wax selected from the group consisting of animal-based wax, plant-based wax, mineral wax, synthetic wax, a wax containing organic acids and/or esters, anhydrides, an emulsifier containing a mixture of organic acids and/or esters, and combinations thereof; and

(B) a polymeric shell,

wherein said polymeric shell comprises at least one polymer selected from polyvinyl alcohol, polyvinyl alcohol copolymers, polyvinyl alcohol terpolymers, polyvinyl acetate, polyvinyl acetate copolymers, polyvinyl acetate terpolymers, cellulose ethers, polyethylene oxide, polyethyleneimines, polyvinylpyrrolidone, polyvinylpyrrolidone copolymers, polyethylene glycol, polyacrylamides and poly (N-isopropylamides), pullulan, sodium alginate, gelatin, starches, and combinations thereof.

3. The low-dust joint compound composition as recited in claim 1, wherein said polymeric shell comprises polyvinyl alcohol.

4. The low-dust joint compound composition as recited in claim 1, further comprising at least one component from a filler;

a binder;

a thickener;

a non-leveling agent;

a preservative;

a rheology modifier; and

a surfactant.

5. The low-dust joint compound composition as recited in claim 4, wherein:

said filler is selected from calcium carbonate (CaCO₃), calcium sulfate dihydrate (CaSO₄ 2H₂O), calcium sulfate hemihydrate (CaSO₄-½

H₂O), glass micro bubbles, mica, perlite, talc, limestone, pyrophyllite, silica, diatomaceous earth, and combinations thereof;

said binder is selected from polyvinyl acetate, polyvinyl alcohol, ethylene vinyl acetate co-polymer, vinylacrylic copolymer, styrenebutadiene, polyacrylamide, acrylic polymers, latex, natural starch, synthetic starch, casein, and combinations thereof;

said thickener is selected from methyl cellulose, hydroxypropyl cellulose, hydroxypropyl methyl cellulose, hydroxyethyl cellulose, hydroxyethyl methyl cellulose, hydroxyethyl hydroxypropyl cellulose, ethylhydroxyethyl cellulose, sodium carboxymethyl cellulose, and combinations thereof; and

said non-leveling agent is selected from attapulgite clay, bentonite, illite, kaolin, sepiolite, clays mixed with starches, and combinations thereof.

6. The low-dust joint compound composition as recited in claim 4, further comprising at least one of cristobalite, a micro-roughened filler, clay, expanded perlite, and combinations thereof.

7. The low-dust joint compound composition as recited in claim 1, wherein said dust-reduction additive emulsion further comprises a second water;

a base; and

a dispersant.

8. The low-dust joint compound composition as recited in claim 7, wherein said dispersant is selected from a dispersant having sulfur;

a dispersant having a sulfur-containing group in the compound;

sulfonic acid (R—

S(═

O)₂—

OH);

sulfonic acid salts, wherein the R group is functionalized with hydroxyl, or carboxyl;

lignosulfonate;

lignosulfonic acid;

naphthalene sulfonic acid;

sulfonate salt of lignosulfonic acid;

sulfonate salt of naphthalene sulfonic acid;

derivatized lignosulfonic acid;

derivatized naphthalene sulfonic acid;

functionalized lignosulfonic acid;

functionalized naphthalene sulfonic acid;

magnesium sulfate;

polycarboxylate;

ammonium hepta molybdate;

combination of ammonium hepta molybdate and starch;

alkyl quaternary ammonium;

montmorillonite clay;

non-ionic surfactants;

ionic surfactants;

zwitterionic surfactants; and

mixtures thereof.

9. The low-dust joint compound composition as recited in claim 7, wherein said base is selected from monoethanol amine;

diethanol amine;

triethanol amine;

imidazole;

potassium siliconate; and

combinations thereof.

10. The low-dust joint compound composition as recited in claim 1, wherein the weight of said dust reduction additive emulsion is in the range of from about 0.1% to about 20% by weight of said low-dust joint compound composition.

11. The low-dust joint compound composition as recited in claim 10, wherein the weight of said dust reduction additive emulsion is in the range of from about 0.1% to about 10% by weight of said low-dust joint compound composition.

12. The low-dust joint compound composition as recited in claim 1, wherein the peak air-borne dust generation of said low-dust joint compound is less than 100 mg/m³.

13. The low-dust joint compound composition as recited in claim 1, wherein the quantity of dust generated upon sanding of said low-dust joint compound composition is reduced at least by 5%.

14. The low-dust joint compound composition as recited in claim 1, wherein the quantity of dust generated upon sanding of said low-dust joint compound composition is reduced at least by 80%.

15. The low-dust joint compound composition as recited in claim 1, further comprising at least one component from a silicone, a siliconate, a fluorinated compound, a stearate, or a combination thereof.

16. The low-dust joint compound of claim 15, wherein the silicones, siliconates, fluorinated compounds, or stearates are selected from the group consisting of metal siliconate salts, potassium siliconate, poly hydrogen methyl siloxane, polydimethyl siloxane, stearate-based salts, and combinations thereof.

17. A method of using said low-dust joint compound composition as recited in claim 1, said method comprising:

(I) applying said composition to a joint between adjacent wallboard panels;

(II) allowing said composition to dry; and

(III) sanding said dried composition.

18. A method for reducing the quantity of dust generated by a joint-compound composition, said method comprising the steps of:

(I) providing a joint-compound composition comprising a filler, a first water, binder, and at least one of a defoamer, wetting agent, preservative, fungicide, thickener, non-leveling agent, surfactant, and a solvent; and

(II) subsequently adding a sufficient quantity of a dust-reduction additive emulsion as described method in claim 2 to said joint-compound composition to reduce the quantity of dust generated by sanding the hardened joint-compound composition by at least 5%.

19. The method for reducing the quantity of dust generated by a joint-compound as recited in claim 18, wherein the quantity of dust generated by sanding said hardened drywall joint-compound is reduced by at least 80%.

20. The method of claim 17, wherein said joint compound composition has a contact angle of about 60°

to about 150°

; and

/or wherein said joint compound composition has a Cobb value of about 5.0 to about 100 g/m².