CIRCUIT BOARD FOR POWER SUPPLY, ELECTRONIC APPARATUS INCLUDING THE SAME, AND INDUCTOR DEVICE

• US 20170094780A1
• Filed: 08/08/2016
• Published: 03/30/2017
• Est. Priority Date: 09/30/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: CHO, Dae-woong, KIM, Dong-keun, KIM, Hyeong-gwon, PARK, Ji-hoon, KIM, Sung-woo
• Granted Patent: US 10,455,687 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/02 without magnetic core
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/2823 Wires H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/324 Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0225 Single or multiple openings in a shielding, ground or power plane H05K1/0227 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10265 Metallic coils or springs, e.g. as part of a connection element

Abstract

A circuit board for a power supply, an electronic apparatus including the same, and an inductor device are provided. The circuit board includes a first pattern arranged on a first layer of the circuit board and including a first terminal coupled to a coil, a first layer region arranged on the first layer, the coil being disposed on the first layer region, and a second pattern arranged on a second layer of the circuit board, below the first layer. The second pattern includes a first blank region located below the first layer region, and has no conductive material arranged thereon.

Claims

1. A circuit board for a power supply, the circuit board comprising:

a first pattern arranged on a first layer of the circuit board and comprising a first terminal coupled to a coil;

a first layer region arranged on the first layer, the coil being disposed on the first layer region; and

a second pattern arranged on a second layer of the circuit board, below the first layer,

wherein the second pattern comprises a first blank region located below the first layer region, and having no conductive material arranged thereon.

2. The circuit board as claimed in claim 1, wherein the first terminal is coupled to a first end of the coil, and

the first layer region further comprises a second terminal coupled to a second end of the coil, and a second blank region having no conductive material arranged thereon.

3. The circuit board as claimed in claim 2, wherein the first terminal and the second terminal protrude in a direction corresponding to a winding direction of the coil.

4. The circuit board as claimed in claim 3, wherein the first terminal comprises:

a first solder pad coupled to the first pattern and the first terminal of the coil; and

a first extension pattern coupled to the first solder pad and protruding in a direction perpendicular to a first arrangement direction of the first solder pad, and

the second terminal comprises;

a second solder pad coupled to a second pattern and the second terminal of the coil; and

a second extension pattern coupled to the second solder pad and protruding in a direction perpendicular to a second arrangement direction of the second solder pad.

5. The circuit board as claimed in claim 4, wherein the first extension pattern comprises a first bend corresponding to the winding direction of the coil, and

the second extension pattern comprises a second bend corresponding to the winding direction of the coil.

6. The circuit board as claimed in claim 4, wherein the extension pattern is configured to reduce normal mode noise of the coil.

7. The circuit board as claimed in claim 1, wherein the circuit board is a two-sided circuit board,

the first layer is disposed on an upper surface of the two-sided circuit board, and

the second layer is disposed on a lower surface of the two-sided circuit board.

8. The circuit board as claimed in claim 1, wherein the circuit board is a multi-layered circuit board,

a ground layer is disposed on a middle of the circuit board, and

the second layer is the ground layer.

9. An electronic apparatus comprising:

a power supply comprising a coil; and

a circuit board comprising;

a first layer comprising a first pattern;

a first layer region arranged on the first layer, the coil being disposed on the first layer region; and

a second layer comprising a second pattern ,

wherein the second pattern comprises a blank region located below the first layer region, and having no conductive material arranged thereon.

10. The electronic apparatus as claimed in claim 9, wherein the first layer region comprises a first terminal coupled to a first end of the coil, a second terminal coupled to a second end of the coil, and a second blank region having no conductive material arranged thereon.

11. The electronic apparatus as claimed in claim 10, wherein the first terminal and the second terminal protrude in a direction corresponding to a winding direction of the coil.

12. The electronic apparatus as claimed in claim 11, wherein first terminal comprises:

a first solder pad coupled to the first pattern and the first terminal of the coil; and

a first extension pattern coupled to the first solder pad and protruding in a direction perpendicular to a first arrangement direction of the first solder pad, and

the second terminal comprises;

a second solder pad coupled to a second pattern and the second terminal of the coil; and

a second extension pattern coupled to the second solder pad and protruding in a direction perpendicular to a second arrangement direction of the second solder pad.

13. The electronic apparatus as claimed in claim 12, wherein the first extension pattern comprises a first bend corresponding to the winding direction of the coil, and

the second extension pattern comprises a second bend corresponding to the winding direction of the coil.

14. An inductor device comprising:

a conductive wire wound a plurality of times in a winding direction;

a first terminal coupled to a first end of the conductive wire and a first solder pad of a circuit board; and

a second terminal coupled to a second end of the conductive wire and a second solder pad of the circuit board,

wherein the first terminal protrudes in a first direction perpendicular to an arrangement direction of the first solder pad, and

the second terminal protrudes in a second direction perpendicular to an arrangement direction of the second solder pad.

15. The inductor device as claimed in claim 14, wherein the first terminal comprises a first bend corresponding to the winding direction, and

the second terminal comprises a second bend corresponding to the winding direction.