CONTACTLESS REPLACEMENT FOR CABLED STANDARDS-BASED INTERFACES

• US 20170099082A1
• Filed: 12/15/2016
• Published: 04/06/2017
• Est. Priority Date: 12/23/2008
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D., Kyles, Ian A.
• Granted Patent: US 9,819,397 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 13/00 Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units interface circuits for specific input/output devices G06F3/00 ; multiprogram control therefor G06F9/46; multiprocessor systems G06F15/16
• CPC Class Codes: H04B 5/24 Inductive coupling
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: H04L 69/08 Protocols for interworking; Protocol conversion

Abstract

A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.

Claims

1-19. -19. (canceled)

20. A dielectric coupler for use in propagating contactless signals between first and second devices, the first device comprising first circuitry and a first transducer, and the second device comprising second circuitry and a second transducer, the dielectric coupler comprising:

a dielectric waveguide structure comprising;

a first end;

a second end;

an elongated portion having a long axis and positioned between the first and second ends, the elongated portion comprising;

at least one dielectric transmission medium for enabling contactless signals to propagate along the long axis; and

a conductive material disposed around the at least one dielectric transmission medium for further enabling propagation of contactless signals along the long axis;

wherein the first end is constructed to be coupled to the first device; and

wherein the second end is constructed to be coupled to the second device.

21. The dielectric coupler of claim 20, wherein when the first end is coupled to the first device, the first transducer is disposed adjacent to the first end.

22. The dielectric coupler of claim 20, wherein when the first end is coupled to the first device, the first transducer is directly coupled to the first end via a dielectric horn.

23. The dielectric coupler of claim 20, wherein when the first end is coupled to the first device, the first transducer is directly coupled to the first end via an interface dielectric.

24. The dielectric coupler of claim 20, wherein the propagation of the contactless signals along the long axis is maintained in a single polarization direction.

25. The dielectric coupler of claim 20, wherein when the first end is coupled to the first device, the first circuitry is electrically coupled to the conductive material.

26. The dielectric coupler of claim 20, wherein the at least one dielectric transmission medium is constructed from one of plastic, glass, rubber, ceramic, and a combination thereof.

27. The dielectric coupler of claim 20, wherein the at least one dielectric transmission medium is constructed from one of polyethylene, and polyvinylchloride, Acrylonitrile-Butadiene-Styrene.

28. The dielectric coupler of claim 20, wherein the conductive material further enables electrical shielding of the contactless signals, power conveyance, and grounding.

29. The dielectric coupler of claim 20, wherein the first and second devices are configured for transporting data according to a Standards-based protocol.

30. The dielectric coupler of claim 29, wherein the Standards-based protocol is selected from the group consisting of USB, PCIe, SATA, SAS, MHL, HDMI, DP, Ethernet I2S, I2C, Thunderbolt, Quickpath, D-PHY, M-PHY and Hypertransport.

31. The dielectric coupler of claim 20, wherein the first device is operative to:

determine an electrical condition of at least one signal line, wherein data carried on the at least one signal line is data that will be contactlessly transmitted, and wherein the at least one signal line is coupled to a controller, which expects the electrical condition of at least one signal line to comply with parameters specified for a Standards-based protocol designed for communicating data over a physical link; and

contactlessly transmit an electromagnetic (EM) signal via the dielectric waveguide structure indicative of the determined electrical condition, wherein the EM signal indicative of the determined electrical condition enables the second device to modify at least one of its signal lines to comply with parameters specified for the Standards-based protocol.

32. A multiple signal path dielectric coupler for use in propagating contactless signals between first and second devices, the first device comprising a first plurality of circuitry and a first plurality of transducers, and the second device comprising a second plurality of circuitry and second plurality of transducers, the multiple signal path dielectric coupler comprising:

a dielectric waveguide structure comprising;

a first end;

a second end;

an elongated portion having a long axis and positioned between the first and second ends, the elongated portion comprising;

a plurality of dielectric transmission mediums, each of the plurality of dielectric transmission mediums serves as a signal path for enabling contactless signals to propagate along the long axis; and

a conductive material disposed around each of the plurality of dielectric transmission mediums for further defining the signal path of each of the plurality of dielectric transmission mediums;

wherein the first end is constructed to be coupled to the first device; and

wherein the second end is constructed to be coupled to the second device.

33. The multiple signal path dielectric coupler of claim 32, wherein

when the first end is coupled to the first device, the first plurality of transducers is disposed adjacent to the first end.

34. The multiple signal path dielectric coupler of claim 32, wherein when the first end is coupled to the first device, the first plurality of transducers is directly coupled to the first end via respective dielectric horns.

35. The multiple signal path dielectric coupler of claim 32, wherein when the first end is coupled to the first device, the first plurality of transducers is directly coupled to the first end via respective interface dielectrics.

36. The multiple signal path dielectric coupler of claim 32, wherein the propagation of the contactless signals along the long axis is maintained in a single polarization direction.

37. The multiple signal path dielectric coupler of claim 32, wherein when the first end is coupled to the first device, the first device is electrically coupled to the conductive material.

38. The multiple signal path dielectric coupler of claim 32, wherein the plurality of dielectric transmission mediums is constructed from one of plastic, glass, rubber, ceramic, and a combination thereof.

39. The multiple signal path dielectric coupler of claim 32, wherein the plurality of dielectric transmission mediums is constructed from one of polyethylene, and polyvinylchloride, Acrylonitrile-Butadiene-Styrene.

40. The multiple signal path dielectric coupler of claim 32, wherein the conductive material further enables electrical shielding of the contactless signals, power conveyance, and grounding.

41. The dielectric coupler of claim 32, wherein the first and second devices are configured for transporting data according to a Standards-based protocol.

42. The dielectric coupler of claim 41, wherein the Standards-based protocol is selected from the group consisting of USB, PCIe, SATA, SAS, MHL, HDMI, DP, Ethernet I2S, I2C, Thunderbolt, Quickpath, D-PHY, M-PHY and Hypertransport.

43. The dielectric coupler of claim 32, wherein the first device is operative to:

determine an electrical condition of at least one signal line, wherein data carried on the at least one signal line is data that will be contactlessly transmitted, and wherein the at least one signal line is coupled to a controller, which expects the electrical condition of at least one signal line to comply with parameters specified for a Standards-based protocol designed for communicating data over a physical link; and

contactlessly transmit an electromagnetic (EM) signal via the dielectric waveguide structure indicative of the determined electrical condition, wherein the EM signal indicative of the determined electrical condition enables the second device to modify at least one of its signal lines to comply with parameters specified for the Standards-based protocol.