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FLEXIBLE THERMAL CONDUIT FOR AN ELECTRONIC DEVICE

  • US 20170099749A1
  • Filed: 12/14/2016
  • Published: 04/06/2017
  • Est. Priority Date: 01/20/2015
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a first housing portion containing an electronic component that generates heat during operation;

    a second housing portion, flexibly coupled to the first housing portion, the second housing portion containing a heat dissipation structure; and

    a multi-layer flexible thermal conduit that passes from the first housing portion to the second housing portion via a region where the second housing portion is flexibly coupled to the first housing portion, to convey heat generated by the electronic component to the heat dissipation structure, the multi-layer flexible thermal conduit including a plurality of stacked, flexible, thermally conductive layers, wherein a surface of each layer of the plurality of stacked, flexible, thermally conductive layers is adjacent to a surface of another layer of the plurality of stacked, flexible, thermally conductive layers.

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