METHOD FOR MANUFACTURING CIRCUIT BOARD

• US 20170127529A1
• Filed: 03/07/2016
• Published: 05/04/2017
• Est. Priority Date: 10/29/2015
• Status: Active Grant

• Current Assignee: Winbond Electronics Corporation
• Original Assignee: Winbond Electronics Corporation
• Inventors: HO, YU-HSUAN
• Granted Patent: US 10,314,174 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 3/1208 Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns providing shape patterns H05K3/1258; adhesion treatments H05K3/38
• CPC Class Codes: H05K 3/125 by ink-jet printing

Abstract

A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

Claims

1. A method for manufacturing a circuit board, comprising:

providing a substrate;

performing a first inkjet printing step to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction, wherein the microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction; and

performing a second inkjet printing step to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

2. The method as claimed in claim 1, wherein the second direction is perpendicular to the first direction.

3. The method as claimed in claim 1, wherein the microstructures each have a substantially rectangular structure, and a major axis thereof is parallel to the second direction.

4. The method as claimed in claim 1, wherein the microstructures each have a length in the first direction that is smaller than a diameter of each conductive ink droplet having a spherical structure.

5. The method as claimed in claim 4, wherein the microstructures each have a width in the second direction that is perpendicular to the first direction, and the width is equal to or greater than the diameter of each conductive ink droplet.

6. The method as claimed in claim 5, wherein the length of the microstructures is about one-half to three-quarters of the diameter of the conductive ink droplets, and the width of the microstructures is about one to two times the diameter of the conductive ink droplets.

7. The method as claimed in claim 4, wherein the microstructures each have a width in the second direction that is perpendicular to the first direction, and the width is smaller than the diameter of each conductive ink droplet.

8. The method as claimed in claim 7, wherein the length and the width of the microstructures are both about one-half of the diameter of the conductive ink droplets.

9. The method as claimed in claim 1, wherein the microstructures are arranged periodically, and the conductive ink droplets are coated periodically on the microstructures, and wherein an arrangement period of the microstructures is the same as a coating period of the conductive ink droplets.

10. The method as claimed in claim 9, wherein the recesses each have a gap distance in the first direction, and the microstructures each have a length in the first direction, and wherein the gap distance equals a difference between the length of the microstructures and the arrangement period of the microstructures.

11. The method as claimed in claim 1, wherein the microstructures each have a T-shaped cross section.

12. The method as claimed in claim 11, wherein the microstructures each have a lower portion connected to the substrate and an upper portion on the lower portion, the upper portion having a substantially rectangular structure, and the lower portion has a substantially rectangular structure, and wherein a major axis of the lower portion is parallel to the second direction.

13. The method as claimed in claim 12, wherein the upper and lower portions of the microstructures are formed by repeated printing.

14. The method as claimed in claim 1, wherein the microstructures are further arranged along the second direction with a spacing therebetween and arranged along the first direction in a staggered manner.

15. The method as claimed in claim 14, wherein the spacing between the microstructures in the second direction is smaller than a diameter of each conductive ink droplet.

16. The method as claimed in claim 1, wherein the microstructures adhere to the substrate.

17. The method as claimed in claim 1, wherein the microstructures comprise non-conductive material.

18. The method as claimed in claim 1, wherein the substrate comprises a copper cladded laminate (CCL), a glass substrate, or a plastic substrate.

19. The method as claimed in claim 1, wherein the conductive ink droplets comprise metal particles and a dispersant.

20. The method as claimed in claim 19, wherein the conductive ink droplets further comprise a binder.