SYSTEMS AND METHODS FOR MONITORING COMPONENT STRAIN

• US 20170146411A1
• Filed: 11/23/2015
• Published: 05/25/2017
• Est. Priority Date: 11/23/2015
• Status: Active Grant

• Current Assignee: GE Infrastructure Technology, LLC (General Electric Company)
• Original Assignee: General Electric Company
• Inventors: Batzinger, Thomas James, Germann, Bryan J., Ranson, William F.
• Granted Patent: US 10,012,552 B2
• Time in Patent Office: Days
• CPC Class Codes: G01B 7/16 for measuring the deformation in a solid, e.g. by resistance strain gauge
• CPC Class Codes: G01L 1/12 by measuring variations in the magnetic properties of materials resulting from the application of stress
• CPC Class Codes: G01L 1/127 by using inductive means G01L1/122, G01L1/125 take precedence
• CPC Class Codes: G01L 1/144 with associated circuitry G01L1/146 and G01L1/148 take precedence
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: G01M 5/0016 of aircraft wings or blades
• CPC Class Codes: G01M 5/0033 by determining damage, crack or wear
• CPC Class Codes: G01M 5/0041 by determining deflection or stress
• CPC Class Codes: G01M 5/0083 by measuring variation of impedance, e.g. resistance, capacitance, induction
• CPC Class Codes: G01M 5/0091 by using electromagnetic excitation or detection

Abstract

A system for monitoring a component is provided. The system may include a strain sensor configured on the component, an electrical field scanner for analyzing the strain sensor, and a processor in operable communication with the electrical field scanner. The processor may be operable for measuring an electrical field value across the strain sensor along a mutually-orthogonal X-axis and Y-axis to obtain a data point set. The processor may further be operable for assembling a field profile of the strain sensor based on the data point set. Methods of using the system are also provided.

Claims

1. A system for monitoring a component, the system comprising:

a strain sensor configured on the component;

an electrical field scanner for analyzing the strain sensor; and

a processor in operable communication with the electrical field scanner, the processor operable for;

measuring an electrical field value across the strain sensor along a mutually-orthogonal X-axis and Y-axis to obtain a data point set, and

assembling a field profile of the strain sensor based on the data point set.

2. The system of claim 1, wherein the electrical field scanner includes an eddy current coil.

3. The system of claim 1, wherein the electrical field scanner includes a Hall Effect probe.

4. The system of claim 1, wherein the electrical field scanner includes a conductivity probe.

5. The system of claim 1, wherein the electrical field scanner includes a capacitance probe.

6. The system of claim 1, wherein the processor is further operable for calculating one or more Z-axis data point in a Z-axis orthogonal to the X-axis and the Y-axis, and assembling a three-dimensional profile of the strain sensor based on the data set and the one or more Z-axis data point.

7. The system of claim 1, wherein the component is formed from a material having a first conductivity value, and wherein the strain sensor comprises a detection material having a second conductivity value different from the first conductivity value.

8. The system of claim 7, wherein the second conductivity value of the detection material is greater than the first conductivity value of the component.

9. The system of claim 1, wherein the component comprises a turbine component having a base and a thermal barrier coating, and wherein the strain sensor is disposed between the base and the thermal barrier coating.

10. The system of claim 1, wherein the processor is further operable for comparing multiple field profiles.

11. A method for monitoring a component, the method comprising:

measuring an electrical field value across a strain sensor configured on the component along a mutually-orthogonal X-axis and Y-axis to a first data point set; and

assembling a first field profile of the strain sensor based on the first data point set.

12. The method of claim 11, wherein the measuring step includes positioning the electrical field scanner across the strain sensor in the X-axis and the Y-axis and parallel to the strain sensor in a Z-axis orthogonal to the X-axis and Y-axis.

13. The method of claim 11, further comprising calculating a first Z-axis data point in a Z-axis orthogonal to the X-axis and the Y-axis, the calculating being based on the first data point set, wherein assembling a first field profile includes assembling a first three-dimensional profile of the strain sensor based on the first data point set and the first Z-axis data point.

14. The method of claim 11, wherein the measuring step includes measuring an eddy current electrical field at an eddy current coil.

15. The method of claim 11, wherein the measuring step includes measuring a Hall magnetic electrical field at a Hall Effect probe.

16. The method of claim 11, wherein the measuring step includes measuring variations in conductivity at a conductivity probe.

17. The method of claim 11, wherein the measuring step includes measuring variations in capacitance at a capacitance probe.

18. The method of claim 14, wherein the measuring step further includes

alternating a current flow through the eddy current coil, thereby inducing an initial electromagnetic field, and

detecting an secondary electromagnetic field, including an eddy current field generated at the strain sensor.

19. The method of claim 11, wherein the measuring step occurs at a first time, and the method further comprises:

measuring the strain sensor along the X-axis and the Y-axis at a second time to obtain a second data point set, the second time being different from the first time; and

assembling a second field profile of the strain sensor based on the second data point set.

20. The method of claim 11, further comprising comparing the first field profile of the strain sensor to a second field profile of the strain sensor.