METHODS AND APPARATUS FOR COLLOCATING ELECTROMAGNETIC COILS AND ELECTRONIC CIRCUITS

• US 20170148567A1
• Filed: 11/23/2016
• Published: 05/25/2017
• Est. Priority Date: 11/25/2015
• Status: Active Grant

• Current Assignee: Vayyar Imaging Ltd.
• Original Assignee: Vayyar Imaging Ltd.
• Inventors: ROSENFELD, Jonathan
• Granted Patent: US 10,056,186 B2
• Time in Patent Office: Days
• CPC Class Codes: G01N 27/025 a current being generated within the material by induction
• CPC Class Codes: G01N 27/72 by investigating magnetic variables
• CPC Class Codes: G01N 27/82 for investigating the presence of flaws
• CPC Class Codes: G01S 13/885 for ground probing prospecting or detecting using electromagnetic waves G01V3/12
• CPC Class Codes: G01V 3/08 operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices with electromagnetic waves G01V3/12
• CPC Class Codes: G01V 3/081 the magnetic field is produced by the objects or geological structures characterised by the method of magnetic field measurement G01R33/00
• CPC Class Codes: G01V 3/10 using induction coils
• CPC Class Codes: G01V 3/101 by measuring the impedance of the search coil; by measuring features of a resonant circuit comprising the search coil measuring impedance or characteristics derived therefrom G01R27/00, e.g. quality factor G01R27/26
• CPC Class Codes: G01V 3/102 by measuring amplitude
• CPC Class Codes: G01V 3/104 using several coupled or uncoupled coils G01V3/101 takes precedence
• CPC Class Codes: G01V 3/105 forming directly coupled primary and secondary coils or loops
• CPC Class Codes: G01V 3/107 using compensating coil or loop arrangements
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H05B 6/44 having more than one coil or coil segment

Abstract

Methods and apparatus according to the invention include inductive units or apparatus such as magnetic metal detectors comprising multiple electromagnetic coils and circuit boards such as electronic printed circuit boards (PCBs) so that the circuit boards, while containing metallic surfaces and layers, are positioned in such a way as to reduce or eliminate their effect on the metal detector'"'"'s coils. The apparatus comprising: a plurality of electromagnetic coils and a plurality of circuit boards, and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils.

Claims

1. An apparatus comprising:

a plurality of electromagnetic coils and a plurality of circuit boards, said circuit boards have planar surface and thickness and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils.

2. The apparatus of claim 1, wherein said at least one of said plurality of electromagnetic coils is symmetric.

3. The apparatus of claim 2, wherein the surface plane of at least one of said plurality of circuit boards is positioned along a symmetry plane of said at least one electromagnetic coil.

4. The apparatus of claim 1, wherein the thickness direction of said plurality of circuit boards is orthogonal to the magnetic field of at least two electromagnetic coils of said plurality of coils.

5. The apparatus of claim 1, wherein at least one of said plurality of circuit boards comprises electronic circuits configured to be connected to or are part of a metal detector.

6. The apparatus of claim 1, wherein at least one of said plurality of said circuit boards comprises circuits configured to be connected to, or are part of a radar detector.

7. The apparatus of claim 1, wherein at least two circuit boards of said plurality of circuit boards are positioned so that their thickness direction is orthogonal to the magnetic field of said at least one coil.

8. The apparatus of claim 7, wherein said at least one coil is symmetric and wherein said at least one coil comprises more than one symmetry plane, and wherein the planar surface of at least two circuit boards of said plurality of circuits boards is substantially along different symmetry planes of said coil.

9. The apparatus of claim 1, wherein the apparatus comprises a detector module said detector module is selected from the group consisting of:

(a) metal detector (b) induction heater (c) noncontact power transfer apparatus (d) noncontact flaw detector.

10. The apparatus of claim 1, wherein said circuit boards are printed circuit boards (PCBs).

11. A method for collocating electromagnetic coils and circuit boards in a detector, said circuit boards have planar surface and thickness, the method comprising:

placing at least one of said circuit boards so that its thickness direction is orthogonal to the magnetic field of at least one of said electromagnetic coils.

12. The method of claim 11, wherein said at least one of said plurality of electromagnetic coils is symmetric.

13. The method of claim 12, wherein the surface plane of at least one of said plurality of circuit boards is positioned along a symmetry plane of said at least one electromagnetic coil.

14. The method of claim 11, wherein the thickness direction of said plurality of circuit boards is orthogonal to the magnetic field of at least two electromagnetic coils of said plurality of coils.

15. The method of claim 11, wherein at least one of said plurality of circuit boards comprises electronic circuits configured to be connected to or are part of a metal detector.

16. The method of claim 11, wherein at least one of said plurality of said circuit boards comprises circuits configured to be connected to, or are part of a radar detector.

17. The method of claim 11, wherein at least two circuit boards of said plurality of circuit boards are positioned so that their thickness direction is orthogonal to the magnetic field of said at least one coil.

18. The method of claim 17, wherein said at least one coil is symmetric and wherein said at least one coil comprises more than one symmetry plane, and wherein the planar surface of at least two circuit boards of said plurality of circuits boards is substantially along different symmetry planes of said coil.

19. The method of claim 11, wherein the detector is selected from the group consisting of:

(a) metal detector (b) induction heater (c) noncontact power transfer apparatus (d) noncontact flaw detector.

20. The method of claim 11, wherein said circuit boards are printed circuit boards (PCBs).