HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR

• US 20170178786A1
• Filed: 12/17/2015
• Published: 06/22/2017
• Est. Priority Date: 12/17/2015
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Lambert, William J., Roy, Mihir K., Manusharow, Mathew J., Deng, Yikang
• Granted Patent: US 10,163,557 B2
• Time in Patent Office: Days
• CPC Class Codes: C25D 5/16 Electroplating with layers of varying thickness
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces
• CPC Class Codes: C25D 7/00 Electroplating characterised by the article coated
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/0206 Manufacturing of magnetic cores by mechanical means magnetic cores per se H01F27/24
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material

Abstract

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

Claims

1. An inductor for an electronic package comprising:

a substrate including at least one substrate layer, each substrate layer including a dielectric layer having a first surface and a second surface opposing the first surface;

an aperture in the at least one dielectric layer located from the first surface to the second surface, the aperture including an aperture wall from the first surface to the second surface;

a conductive layer deposited on the first surface, second surface, and the aperture wall; and

at least one coil cut from the conductive layer, the at least one coil located on the aperture wall.

2. The inductor of claim 1, wherein the at least one coil includes a helical shape.

3. The inductor of claim 1, further comprising a magnetic core within the aperture.

4. The inductor of claim 3, wherein the magnetic core includes magnetic particles suspended in a carrier.

5. The inductor of claim 1, wherein the substrate includes a second substrate layer including at least one electrical contact, the electrical contact configured for electrical communication.

6. The inductor of claim 5, wherein the substrate includes a substrate core and at least one secondary substrate layer includes a sequential layer build-up.

7. A method of making an inductor comprising:

providing a dielectric layer with a first surface and a second surface;

drilling the dielectric layer from the first surface to the second surface to form an aperture in the first and second surfaces, the aperture including an aperture wall from the first surface to the second surface;

depositing a conductive layer on the first surface, second surface, and the aperture wall; and

cutting a portion of the conductive layer through the entire thickness to form one or more coils on the aperture wall, wherein the coil encircles the aperture wall in at least one revolution from the first surface to the second surface.

8. The method of claim 7, wherein cutting a portion of the conductive layer on the aperture wall includes removing the conductive layer with a coil cutting bit.

9. The method of claim 8, wherein cutting the portion of the conductive layer on the aperture wall with the coil cutting bit includes:

rotating and translating the coil cutting bit in a sequence along a path from the first surface to the second surface thereby removing the conductive layer on the aperture wall; and

rotating and translating the coil cutting bit in a reverse sequence along the path to withdrawal the coil cutting bit from the aperture.

10. The method of claim 9, wherein the sequence includes a helical path.

11. The method of claim 7, further comprising locating a magnetic core within the aperture.

12. The method of claim 11, wherein locating the magnetic core within the aperture includes depositing, within the aperture, magnetic particles suspended in a carrier.

13. The method of claim 7, wherein providing the dielectric layer includes providing a substrate core.

14. An electronic package including a though-hole inductor comprising:

a substrate including at least one substrate layer, each substrate layer including a dielectric layer having a first surface and a second surface;

an aperture in the dielectric layer located from the first surface to the second surface, the aperture including an aperture wall extended from the first surface to the second surface;

a conductive layer deposited on the first surface, second surface, and the aperture wall; and

at least one coil cut from the conductive layer, the at least one coil includes a helical shape located on the aperture wall from the first surface to the second surface, wherein the at least one coil is configured to generate an electro-magnetic flux.

15. The electronic package of claim 14, wherein the electronic package includes an integrated voltage regulator.

16. The electronic package of claim 14, further comprising a magnetic core disposed within the aperture.

17. The electronic package of claim 16, wherein the magnetic core includes magnetic particles suspended within a carrier.

18. The electronic package of claim 17, wherein the magnetic core includes magnetic nanoparticles.

19. The electronic package of claim 14, wherein the substrate includes a second substrate layer, the second substrate layer can include a secondary conductive layer, the secondary conductive layer includes at least one electrical contact configured for electrical communication.

20. The electronic package of claim 19, wherein the substrate includes a substrate core and at least one second substrate layer includes a sequential layer build-up.

21. The electronic package of claim 14, further comprising a buck converter circuit, the buck converter circuit including at least a capacitor and a resistor located on a silicon die.