LIGHT EMITTING ELEMENT

• US 20170186918A1
• Filed: 12/20/2016
• Published: 06/29/2017
• Est. Priority Date: 12/25/2015
• Status: Active Application

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: KONDO, Hiroki
• Granted Patent: US 10,263,158 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting element includes: a semiconductor stack; a light reflecting layer, in which a dielectric multilayer film is included, on an upper surface of the semiconductor stack; a light transmissive insulating layer that covers the light reflecting layer and is provided on the upper surface of the semiconductor stack around the periphery of the light reflecting layer; a light transmissive conducting layer that covers the light transmissive insulating layer and is provided on the upper surface of the semiconductor stack around the periphery of the light transmissive insulating layer; and an electrode that is provided on an upper surface of the light transmissive conducting layer so that the outer edge of the electrode coincides with an outer edge of the light reflecting layer or the outer edge of the electrode is positioned at inside of the outer edge of the light reflecting layer, as seen from an upper surface side.

Claims

1. A light emitting element comprising;

a semiconductor stack;

a light reflecting layer, in which a dielectric multilayer film is included, on an upper surface of the semiconductor stack;

a light transmissive insulating layer that covers the light reflecting layer and is provided on the upper surface of the semiconductor stack around the periphery of the light reflecting layer;

a light transmissive conducting layer that covers the light transmissive insulating layer and is provided on the upper surface of the semiconductor stack around the periphery of the light transmissive insulating layer; and

an electrode that is provided on an upper surface of the light transmissive conducting layer so that the outer edge of the electrode coincides with an outer edge of the light reflecting layer or the outer edge of the electrode is positioned at inside of the outer edge of the light reflecting layer, as seen from an upper surface side.

2. The light emitting element according to claim 1, wherein

refractive index of the light transmissive insulating layer is less than refractive index of the semiconductor layer being in contact with the light transmissive insulating layer, among the plurality of semiconductor layers included in the semiconductor stack.

3. The light emitting element according to claim 1, wherein

refractive index of the light transmissive insulating layer is greater than refractive index of the light transmissive conducting layer.

4. The light emitting element according to claim 2 wherein

refractive index of the light transmissive insulating layer is greater than refractive index of the light transmissive conducting layer.

5. The light emitting element according to claim 2, wherein

the light transmissive insulating layer is formed of SiN or SiON.

6. The light emitting element according to claim 3, wherein

the light transmissive insulating layer is formed of SiN or SiON.

7. The light emitting element according to claim 4, wherein

the light transmissive insulating layer is formed of SiN or SiON.

8. The light emitting element according to claim 5, wherein

thickness of the light transmissive insulating layer is in a range of 100 nm to 200 nm.

9. The light emitting element according to claim 6, wherein

thickness of the light transmissive insulating layer is in a range of 100 nm to 200 nm.

10. The light emitting element according to claim 7, wherein

thickness of the light transmissive insulating layer is in a range of 100 nm to 200 nm.

11. The light emitting element according to claim 1, wherein

the light reflecting layer includes a dielectric multilayer film and a metal film, and

the metal film is provided on an upper surface of the dielectric multilayer film.

12. The light emitting element according to claim 11, wherein

the metal film contains aluminum or silver.

13. The light emitting element according to claim 12, wherein

the metal film is made up of an AlCu alloy or an AlNd alloy.

14. The light emitting element according to claim 1, wherein

the light transmissive conducting layer is made up of an oxide containing one or more elements selected from the group having zinc, indium, tin and magnesium.

15. The light emitting element according to claim 3, wherein

the light transmissive conducting layer is made up of an oxide containing one or more elements selected from the group having zinc, indium, tin and magnesium.

16. The light emitting element according to claim 4, wherein

the light transmissive conducting layer is made up of an oxide containing one or more elements selected from the group having zinc, indium, tin and magnesium.

17. The light emitting element according to claim 6, wherein

the light transmissive conducting layer is made up of an oxide containing one or more elements selected from the group having zinc, indium, tin and magnesium.

18. The light emitting element according to claim 1, wherein

the semiconductor stack is made up of a nitride semiconductor.

19. The light emitting element according to claim 2, wherein

the semiconductor stack is made up of a nitride semiconductor.