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Three-Dimensional (3D) Photonic Chip-to-Fiber Interposer

  • US 20170219772A1
  • Filed: 04/19/2017
  • Published: 08/03/2017
  • Est. Priority Date: 05/04/2015
  • Status: Active Grant
First Claim
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1. A method of fabricating an optical coupling device, comprising:

  • forming a waveguide mask layer on a surface of a substrate platform, the waveguide mask layer comprising an array of openings including a first end and a second end opposite to the first end;

    immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, the array of waveguides corresponding to the array of openings; and

    controlling a rate of the immersing such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, the array of waveguides extending in the direction from the first end to the second end.

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