THIN-FILM DEVICES AND FABRICATION
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Abstract
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
14 Citations
137 Claims
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1-120. -120. (canceled)
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121. An optical device comprising:
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a substantially transparent substrate; a plurality of layers on the substantially transparent substrate, the plurality of layers comprising; a first transparent conducting layer; a second transparent conducting layer; and one or more material layers sandwiched in between the first and second transparent conducting layers, the one or more material layers comprising at least one optically switchable material, wherein the second transparent conducting layer is co-extensive with the one or more material layers; and a transparent vapor barrier layer over the plurality of layers, the transparent vapor barrier layer configured to resist moisture and wherein the transparent vapor barrier layer is electrically conductive. - View Dependent Claims (122, 123, 124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134)
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135. A method of fabricating an optical device comprising a plurality of layers on a substantially transparent substrate, wherein the plurality of layers comprises a first transparent conducting layer, a second transparent conducting layer, one or more material layers comprising at least one optically switchable material, and a transparent vapor barrier layer configured to resist moisture and which is electrically conductive, the method comprising:
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receiving a substantially transparent substrate comprising the first transparent conducting layer; removing a first width of the first transparent conducting layer at the periphery of the substantially transparent substrate and along between about 10% and about 90% of the perimeter of the substrate; and depositing, in the following order, the one or more material layers, the second transparent conducting layer and a transparent vapor barrier layer, to cover and extend beyond the first conducting layer into the first width at the periphery of the substantially transparent substrate. - View Dependent Claims (136, 137)
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Specification