SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
First Claim
1. A method of producing a semiconductor device, the method comprising:
- forming an insulating film on a substrate on which a semiconductor layer is formed;
removing a part of the insulating film by etching to form an opening in the insulating film;
supplying steam with a temperature greater than or equal to 200°
C. and less than or equal to 600°
C. to the opening formed in the insulating film;
after supplying the steam, applying a solution including a silicon compound to a side surface of the insulating film defining the opening; and
forming a hydrophobic film on the side surface of the insulating film defining the opening by polymerizing the silicon compound.
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Accused Products
Abstract
A method of producing a semiconductor device includes forming an insulating film on a substrate on which a semiconductor layer is formed; removing a part of the insulating film by etching to form an opening in the insulating film; supplying steam with a temperature greater than or equal to 200° C. and less than or equal to 600° C. to the opening formed in the insulating film; after supplying the steam, applying a solution including a silicon compound to a side surface of the insulating film defining the opening; and forming a hydrophobic film on the side surface of the insulating film defining the opening by polymerizing the silicon compound.
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10 Claims
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1. A method of producing a semiconductor device, the method comprising:
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forming an insulating film on a substrate on which a semiconductor layer is formed; removing a part of the insulating film by etching to form an opening in the insulating film; supplying steam with a temperature greater than or equal to 200°
C. and less than or equal to 600°
C. to the opening formed in the insulating film;after supplying the steam, applying a solution including a silicon compound to a side surface of the insulating film defining the opening; and forming a hydrophobic film on the side surface of the insulating film defining the opening by polymerizing the silicon compound. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification