ANTENNA MODULE AND CIRCUIT MODULE

• US 20170229769A1
• Filed: 04/27/2017
• Published: 08/10/2017
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Yokoyama, Michiharu, Amachi, Nobumitsu
• Granted Patent: US 10,468,763 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15322 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/24 : with receiving set
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/526 : Electromagnetic shields
• CPC Class Codes: H01Q 19/30 : the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 21/065 : Patch antenna array
• CPC Class Codes: H01Q 21/067 : using endfire radiating aerial units transverse to the plane of the array
• CPC Class Codes: H01Q 21/22 : Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array
• CPC Class Codes: H01Q 21/28 : Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 25/00 : Antennas or antenna systems providing at least two radiating patterns arrangements for changing or varying the orientation or the shape of the directional pattern H01Q3/00

Abstract

An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.

Claims

1. An antenna module comprising:

a dielectric substrate in which an antenna being disposed, the antenna comprising a conductor pattern;

a high-frequency semiconductor device that is mounted on a bottom surface of the dielectric substrate and that supplies a high-frequency signal to the antenna;

a plurality of conductor columns that projects from the bottom surface; and

a dielectric member that is disposed on the bottom surface and in which the conductor columns are embedded such that an end of each of the conductor columns projects out from the dielectric member,

wherein the dielectric member defines a mounting surface that faces a mounting substrate, and

wherein a step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a part of the side surface extending from the mounting surface to the step is more recessed than other part of the side surface that is located above the step.

2. The antenna module according to claim 1,

wherein the antenna has directivity in a direction parallel to a substrate surface of the dielectric substrate, and the step is disposed so as to be closer to the mounting surface than the antenna is.

3. The antenna module according to claim 1,

wherein a surface roughness of the part of the side surface extending from the mounting surface to the step is larger than a surface roughness of the other part of the side surface located above the step.

4. The antenna module according to claim 1,

wherein the high-frequency semiconductor device is embedded in the dielectric member.

8. The antenna module according to claim 2,

wherein a surface roughness of the part of the side surface extending from the mounting surface to the step is larger than a surface roughness of the other part of the side surface located above the step.

9. The antenna module according to claim 2,

wherein the high-frequency semiconductor device is embedded in the dielectric member.

10. The antenna module according to claim 3,

wherein the high-frequency semiconductor device is embedded in the dielectric member.

5. A circuit module comprising:

a dielectric substrate on which a conductor pattern is provided;

a first semiconductor device that is mounted on a bottom surface of the dielectric substrate and connected to the conductor pattern;

a plurality of conductor columns that projects from the bottom surface; and

a dielectric member that is disposed on the bottom surface and in which the conductor columns are embedded such that an end of each of the conductor columns projects out from the dielectric member,

wherein the dielectric member defines a mounting surface that faces a mounting substrate, and

wherein a step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a portion of the side surface extending from the mounting surface to the step is more recessed than other portion of the side surface that is located above the step.

6. The circuit module according to claim 5,

wherein the portion of the side surface extending from the mounting surface to the step has a roughness larger than a roughness of the other portion of the side surface that is located above the step.

7. The circuit module according to claim 5, further comprising:

a second semiconductor device that is mounted on a top surface of the dielectric substrate;

a sealing-resin layer that coats the top surface and in which the second semiconductor device is embedded, the sealing-resin layer having a side surface, which is more recessed than a side surface of the dielectric substrate; and

a shield layer that coats the sealing-resin layer and that is connected to a ground layer, which is provided on the dielectric substrate, at a position further outside than the side surface of the sealing-resin layer is.

11. The circuit module according to claim 6, further comprising:

a second semiconductor device that is mounted on a top surface of the dielectric substrate;

a sealing-resin layer that coats the top surface and in which the second semiconductor device is embedded, the sealing-resin layer having a side surface, which is more recessed than a side surface of the dielectric substrate; and

a shield layer that coats the sealing-resin layer and that is connected to a ground layer, which is provided on the dielectric substrate, at a position further outside than the side surface of the sealing-resin layer is.