OPEN DIAPHRAGM HARSH ENVIRONMENT PRESSURE SENSOR

• US 20170234752A1
• Filed: 02/11/2016
• Published: 08/17/2017
• Est. Priority Date: 02/11/2016
• Status: Active Grant

• Current Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Potasek, David P., Little, Charles, Zhang, Weibin
• Granted Patent: US 10,101,234 B2
• Time in Patent Office: Days
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/146 using flexible element between the transducer and the support
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: G01L 9/0072 using variations in capacitance

Abstract

A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

Claims

1. A pressure sensor comprising:

a housing;

a diaphragm wafer comprising;

a fluid contact surface;

a diaphragm located along the surface and configured to deflect in response to pressure;

a sensing element that is responsive to deflection of the diaphragm; and

a support portion, wherein the support portion and the diaphragm define a cavity; and

an isolator configured to absorb lateral stresses, wherein the isolator is connected between the support portion of the diaphragm wafer and the housing such that an inner portion of the isolator is attached to the support portion and an outer portion of the isolator is attached to the housing, and the isolator is parallel to the fluid contact surface.

2. The pressure sensor of claim 1, wherein the housing comprises a housing end and a sidewall.

3. The pressure sensor of claim 2, wherein the housing includes a back plate.

4. The pressure sensor of claim 1, wherein the housing includes a weld feature configured to allow attachment of the pressure sensor to transducer electronics.

5. The pressure sensor of claim 1, wherein the sensing element is a piezoresistive device or capacitive plates.

6. The pressure sensor of claim 1, wherein the isolator is comprised of a material selected from the group consisting of an iron-nickel alloy, silicon, glass, ceramic and stainless steel foil, or a combination thereof.

7. The pressure sensor of claim 1, wherein the isolator attaches to the diaphragm wafer at a widest end of the cavity and the cavity converges to an apex from the isolator to the diaphragm.

8. The pressure sensor of claim 1, wherein the cavity retains a uniform cross-sectional area.

9. The pressure sensor of claim 1, wherein the diaphragm wafer and the isolator are a monolithic structure.

10. The pressure sensor of claim 1, wherein the isolator is coated such that it can be bonded to the housing and attached to the diaphragm wafer.

11. The pressure sensor of claim 1 and further comprising a topping wafer attached to the diaphragm wafer and configured to provide reference pressure.

12. The pressure sensor of claim 1 and further comprising an over pressure support rigidly attached to the housing and the topping wafer, and configured to prevent over-pressurization of the pressure sensor.

13. The pressure sensor of claim 1, further comprising tubing configured to allow gage pressure measurements.

14. The pressure sensor of claim 1, further comprising:

a connector attached to the housing;

one or more wire-bonds; and

one or more printed circuit boards attached to the connector, and attached to the diaphragm wafer through the one or more wire-bonds.

15. The pressure sensor of claim 1, further comprising at least one electrical feedthrough pin that runs through the housing and is electrically connected to the sensing element.

16. The pressure sensor of claim 15, and further comprising a seal, which is configured to electrically insulate the at least one electrical feedthrough pin where it runs through the housing.

17. A method for creating a pressure sensor, the method comprising:

fabricating a diaphragm wafer comprising a fluid contact surface, a diaphragm located along the surface and configured to deflect in response to pressure, a sensing element that is responsive to deflection of the diaphragm, and a support portion, wherein the support portion and the diaphragm define a cavity;

fabricating an isolator configured to absorb lateral stresses;

fabricating a housing;

connecting the isolator to the housing; and

attaching the diaphragm wafer to the isolator, such that the support portion of the diaphragm wafer is attached to an inner portion of the isolator, an outer portion of the isolator is attached to the housing, and the fluid contact surface of the diaphragm wafer is parallel to the isolator.

18. The method of claim 17, and further comprising:

fabricating a topping wafer configured to provide reference pressure;

fabricating an over-pressure support;

attaching a topping wafer to the diaphragm wafer;

attaching an over-pressure support to the topping wafer; and

rigidly attaching the over-pressure support to the housing.

19. The method of claim 17, and further comprising:

attaching at least one printed circuit board to the housing;

attaching the at least one printed circuit board to the diaphragm wafer through at least one wire-bond;

connecting the at least one printed circuit boards to a connector through at least one wire; and

attaching the connector along the housing.

20. The method of claim 17, and further comprising:

chemically milling at least one hole in the isolator;

bonding the sensing element of the diaphragm wafer to at least one electrical feedthrough pin;

running the at least one electrical feedthrough pin through the at least one hole in the isolator;

sealing the at least one hole; and

connecting the at least one electrical feedthrough pin to a transducer electronics.