Circuit Board Assembly And Method Of Manufacturing The Same

• US 20170237204A1
• Filed: 02/02/2017
• Published: 08/17/2017
• Est. Priority Date: 02/12/2016
• Status: Active Grant

• Current Assignee: Jtekt Corporation (Toyota Motor Corporation)
• Original Assignee: Jtekt Corporation (Toyota Motor Corporation)
• Inventors: Toyama, Yuichi
• Granted Patent: US 9,979,137 B2
• Time in Patent Office: Days
• CPC Class Codes: H01R 13/504 different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
• CPC Class Codes: H01R 13/665 with built-in electronic circuit H01R13/70, H01R13/719 take precedence
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: H05K 5/006 characterized by features for holding the PCB within the housing

Abstract

A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover of a circuit board assembly includes a first cover to cover a first surface of a circuit board and a second cover to cover a second surface of the circuit board. A projection portion projects from an inner surface of the first cover. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly as an insert part, the projection portion suppresses deformation of the first cover and the second cover.

Claims

1. A circuit board assembly comprising:

a circuit board having an area on which electronic components are mounted; and

a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area, wherein

the cover is provided, on its inner surface, with a suppression portion that suppresses the inner surface from approaching the area when external pressure is applied to the cover.

2. The circuit board assembly according to claim 1, wherein

the cover includes a first cover to cover a first surface of the circuit board and a second cover to cover a second surface of the circuit board;

and

the suppression portion projects from at least one of the first cover and the second cover.

3. The circuit board assembly according to claim 2, wherein

the suppression portion is a projection portion projecting from a first portion of the inner surface of the cover and passing through the circuit board;

and

a leading end of the projection portion is positioned such that the leading end contacts or is allowed to contact a second portion of the inner surface of the cover, the second portion facing the first portion.

4. The circuit board assembly according to claim 2, wherein

the suppression portion is constituted of a first projection portion and a second projection portion projecting from portions of the inner surface of the cover;

the portions of the inner surface of the cover face each other; and

the first projection portion is positioned such that the first projection portion passes through the circuit board and contacts or is allowed to contact a leading end of the second projection portion.

5. A complete circuit board assembly comprising:

the circuit board assembly according to claim 1; and

an outer structure made of synthetic resin and covering outer faces of the cover of the circuit board assembly, wherein

an inner surface of the cover is provided with a suppression portion that suppresses the inner surface from approaching the area.

6. A method of manufacturing a complete circuit board assembly which includes:

a circuit board having an area on which electronic components are mounted; and

a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area;

an outer structure made of synthetic resin which covers outer faces of the cover,

the method comprising;

accommodating the cover in a mold as an insert, the cover containing the circuit board; and

insert-molding the outer structure on outer faces of the cover that contains the circuit board, wherein

an inner surface of the cover is provided with a suppression portion that projects toward an inner surface of the cover, the inner surfaces facing each other via the circuit board; and

the suppression portion suppresses the inner surfaces of the cover from being deformed by molding pressure and approaching the circuit board when the outer structure is insert-molded.