INTEGRATION OF WIRELESS CHARGING COIL TO A CHASSIS

• US 20170279291A1
• Filed: 03/25/2016
• Published: 09/28/2017
• Est. Priority Date: 03/25/2016
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: MIELE, Ralph V., PAYNE, David G., COURTNEY, Brandon, SIMPSON, Isaac A., LARSON, Andrew, PIDWERBECKI, David, CHEWNING, Patrick
• Granted Patent: US 10,027,160 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 27/2847 Sheets; Strips H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/366 made of ferromagnetic material
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A method may be provided for forming a wireless charging electronic device. This may be performed by integrating a coil and a collector plate to a chassis of the electronic device.

Claims

1. A method of forming a wireless charging device, comprising:

providing a coil for wireless charging;

providing a collector plate; and

injection molding the coil and the collector plate to a chassis of the wireless charging device to form an integrated chassis.

2. The method of claim 1, wherein providing the coil includes stamping the coil.

3. The method of claim 1, wherein providing the collector plate includes stamping the collector plate.

4. The method of claim 1, wherein injection molding the coil and the collector plate includes insert molding the coil and the collector plate to the chassis of the wireless charging device.

5. The method of claim 4, wherein insert molding the coil and the collector plate to the chassis includes:

attaching the coil to a structural carrier to form a structural assembly; and

insert molding the structural assembly to the chassis to form an injection molded housing.

6. The method of claim 5, wherein insert molding the coil and the collector plate to the chassis further includes:

attaching the collector plate to the injection molded housing.

7. The method of claim 1, wherein injection molding the coil and the collector plate includes:

attaching the coil and the collector plate to the chassis to form a single structural assembly; and

insert molding the single structural assembly to the chassis.

8. The method of claim 1, further comprising providing a ferrite layer on the coil.

9. The method of claim 1, further comprising providing a controller board on the chassis.

10. The method of claim 9, wherein the controller board is provided on the collector plate such that the collector plate is between the chassis and the controller board.

11. A method of forming a wireless charging device, comprising;

providing a chassis of the wireless charging device;

providing an electro-less plating of a coil to the chassis; and

providing an electro-plating of the coil to the chassis to integrate the coil to the chassis and provide an integrated chassis.

12. The method of claim 11, further comprising:

providing an electro-less plating of a collector plate to the chassis; and

providing electro-plating of the collector plate to the chassis to integrate the collector plate to the integrated chassis.

13. The method of claim 11, further comprising providing mask areas on the chassis.

14. The method of claim 13, wherein the mask areas are provided on an inner surface of the chassis.

15. An electronic device to provide wireless charging, comprising:

a chassis having a power receiving unit to wirelessly receive power, the power receiving unit includes a charging coil and a collector plate integrated into the chassis.

16. The electronic device of claim 15, wherein the collector plate is substantially planar with the charging coil.

17. The electronic device of claim 15, wherein the power receiving unit is directly insert molded into the chassis.

18. The electronic device of claim 15, wherein the chassis has a first surface that defines a first plane and a second surface that defines a second plane, wherein the coil is provided at the chassis between the first plane and the second plane, and wherein the collector plate is provided between the first plane and the second plane.

19. The electronic device of claim 18, wherein the power receiving unit includes a ferrite layer, wherein the ferrite layer is provided between the coil and the first plane of the chassis, and wherein an insulating layer is provided between the coil and the ferrite layer.

20. The electronic device of claim 15, wherein the power receiving unit includes a controller board, wherein the controller board is on the collector plate.