PRESSURE-ACTIVATED ELECTRICAL INTERCONNECTION BY MICRO-TRANSFER PRINTING

• US 20170287789A1
• Filed: 03/17/2017
• Published: 10/05/2017
• Est. Priority Date: 04/01/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher Andrew, Cok, Ronald S., Meitl, Matthew, Prevatte, JR., Carl Ray
• Granted Patent: US 10,103,069 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 2224/02123 inside the bonding area
• CPC Class Codes: H01L 2224/13008 Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13013 being rectangular or square
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/1411 the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/75305 comprising protrusions
• CPC Class Codes: H01L 2224/75315 Elastomer inlay
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/814 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/8182 Diffusion bonding
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/81986 Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83862 : Heat curing
• CPC Class Codes: H01L 2224/83986 : Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/951 : Supplying the plurality of semiconductor or solid-state bodies
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/98 : Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/124 : with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 10/82 : Electrodes
• CPC Class Codes: H10K 50/805 : Electrodes
• CPC Class Codes: H10K 59/1201 : Manufacture or treatment
• CPC Class Codes: H10K 59/129 : Chiplets
• CPC Class Codes: H10K 71/611 : using printing deposition, e.g. ink jet printing

Abstract

A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

Claims

1. A printed electrical connection structure, comprising:

a substrate having one or more electrical connection pads;

a printed component having one or more connection posts, each connection post in electrical contact with a connection pad; and

a resin disposed between and in contact with the substrate and the printed component, the resin having a reflow temperature less than a cure temperature, wherein the resin repeatedly flows at the reflow temperature when temperature cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to the cure temperature.

2. The printed structure of claim 1, comprising a solder disposed on the connection post, on the connection pad or on both the connection post and the connection pad.

10. The printed structure of claim 1, wherein the printed component is a first printed component, the one or more connection pads are one or more first connection pads, and comprising a second printed component having one or more second connection posts, each second connection post in electrical contact with the second connection pads, the resin is disposed between and in contact with the substrate and the second printed component, and the first and second connection pads are electrically connected so that the first and second components are electrically connected in parallel.

3-9. -9. (canceled)

11. (canceled)

12. A method of making a printed structure, comprising:

providing a substrate having one or more electrical connection pads;

disposing a resin layer over and in contact with at least a portion of the substrate;

micro-transfer printing a component from a component source wafer to the substrate, the component having one or more connection posts that are each positioned adjacent to a corresponding connection pad, so that the resin contacts at least a portion of the printed component.

13. The method of claim 12, wherein the resin has a reflow temperature less than a cure temperature, wherein the resin repeatedly flows at a first rate at the reflow temperature when temperature cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature.

14. The method of claim 13, comprising testing the component.

15. The method of claim 13, comprising heating the resin to the reflow temperature and electrically contacting each connection post to the corresponding connection pad.

16. The method of claim 15, comprising cooling the structure after heating the resin to the reflow temperature.

17. The method of claim 16, comprising reheating the structure to the reflow temperature after cooling the structure.

18. The method of claim 16, comprising cooling the structure after reheating the resin to the reflow temperature.

19. The method of claim 18, comprising heating the structure to the cure temperature after reheating the resin to the reflow temperature.

20. The method of claim 17, comprising testing the structure after reheating the resin to the reflow temperature.

21. The method of claim 15, comprising testing the structure after heating the resin to the reflow temperature.

22. The method of claim 12, comprising providing a layer of solder over at least the one or more connection pads, the solder having a melting temperature.

26. The method of claim 12, comprising providing an electrical conductor electrically connected to one of the connection pads, and cutting the electrical conductor.

27. The method of claim 12, wherein the component is a first component, the one or more connection pads are one or more first connection pads, and comprising providing one or more second connection pads electrically connected in parallel with the one or more first connection pads.

28. The method of claim 27, comprising determining that the first component failed the test.

29. The method of claim 28, comprising providing an electrical conductor electrically connected to one of the connection pads, and cutting the electrical conductor.

23-25. -25. (canceled)

30-34. -34. (canceled)

35. A micro-transfer printable component, comprising:

a dielectric substrate having a post side and a circuit side;

one or more electrically conductive connection posts protruding from the post side of the dielectric substrate;

a circuit disposed on the circuit side of the dielectric substrate; and

an electrode electrically connecting each of the connection posts to the circuit.

36. The micro-transfer printable component of claim 35, comprising a via corresponding to each connection post, the via extending from the circuit side of the dielectric substrate to a portion of the corresponding connection post, the electrode extending into the via to electrically connect the circuit to the corresponding connection post.

37-50. -50. (canceled)