CAMERA FOR VEHICLE VISION SYSTEM

• US 20170295306A1
• Filed: 04/04/2017
• Published: 10/12/2017
• Est. Priority Date: 04/08/2016
• Status: Active Grant

• Current Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Original Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Inventors: Mleczko, Jamie A.
• Granted Patent: US 10,142,532 B2
• Time in Patent Office: Days
• CPC Class Codes: B29C 2945/76498 Pressure
• CPC Class Codes: B29C 2945/76859 Injection
• CPC Class Codes: B29C 45/1615 The materials being injected at different moulding stations
• CPC Class Codes: B29C 45/77 of velocity or pressure of moulding material
• CPC Class Codes: B29K 2069/00 Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2077/00 Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 5/0034 having an overmolded housing covering the PCB
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A vehicular camera module includes a circuit element and a lens mounting element disposed at the circuit element and optically aligned with an imager of the circuit element. An inner lower pressure polymer molding is formed at least partially over and around the circuit element and the lens mounting element so that the inner molding and the lens mounting element substantially encase the circuit element. A connector element is disposed at an aperture of the inner molding so as to be in electrical contact with the electrical connecting elements of the circuit element. An outer higher pressure injection molded shell is molded over and around the inner molding and part of the lens mounting element so as to encase the inner molding. The outer shell includes a connector portion that generally surrounds the connector element, with the connector element being accessible at the connector portion of the outer shell.

Claims

1. A camera module for a vision system for a vehicle, said camera module comprising:

a circuit element, said circuit element including an imager and associated circuitry, wherein said circuit element includes electrical connecting elements;

a lens mounting element for holding a lens assembly, said lens assembly including at least one optical element;

wherein said lens mounting element is disposed at said circuit element and said at least one optical element is optically aligned with said imager of said circuit element;

an inner molding formed over and around said circuit element and over a portion of said lens mounting element so that said inner molding and said lens mounting element substantially encase said circuit element;

wherein said inner molding comprises a first molded polymer molded at a first molding pressure;

wherein said inner molding has an aperture established at said electrical connecting elements of said circuit element;

a connector element disposed at said aperture so as to be in electrical contact with said electrical connecting elements of said circuit element;

an outer shell molded over and around said inner molding and over another portion said lens mounting element so as to encase said inner molding;

wherein said outer shell comprises a second molded polymer injection molded at a second molding pressure;

wherein said second molding pressure is greater than said first molding pressure;

wherein said outer shell comprises a connector portion that surrounds said connector element, and wherein said connector element is accessible at said connector portion of said outer shell; and

wherein said connector portion is configured to connect to a connector end of a wire harness to electrically connect the connector end of the wire harness to said connector element to establish electrical connection between the wire harness and said electrically connecting elements of said circuit element.

2. The camera module of claim 1, wherein said camera module is configured to be disposed at an exterior portion of a vehicle so as to have a field of view exterior of the vehicle.

3. The camera module of claim 1, wherein said electrical connecting elements of said circuit element comprise a plurality of electrically conductive pads electrically connected to circuitry of said circuit element, and wherein said connector element comprises a plurality of electrically conductive terminals that electrically connect to said electrically conductive pads when said connector element is disposed at said aperture of said inner molding.

4. The camera module of claim 3, wherein said connector element is press fit into a receiving structure of said inner molding at said aperture.

5. The camera module of claim 3, wherein said plurality of electrically conductive terminals comprise a plurality of spring-biased pins.

6. The camera module of claim 1, wherein said connector element comprises a coaxial connector element configured to electrically connect to a coaxial connector end of a coaxial wire harness of the vehicle.

7. The camera module of claim 1, wherein said first molded polymer comprises a thermally conductive hot melt adhesive.

8. The camera module of claim 1, wherein said second molded polymer is molded over a tip feature of said lens mounting element and wherein, when said second molded polymer is heated and molded over said tip feature, said tip feature melts and bonds with said second molded polymer to create a hermetic seal between said outer shell and said lens mounting element.

9. The camera module of claim 1, wherein said lens mounting element is adhesively attached at said circuit element and wherein the adhesive is at least partially cured before said inner molding is molded over and around said circuit element.

10. The camera module of claim 1, wherein said circuit element comprises a printed circuit board with said imager disposed at one side of said printed circuit board and said electrical connecting elements disposed at the opposite side of said printed circuit board.

11. The camera module of claim 1, wherein said first molding pressure is less than 500 psi and said second molding pressure is greater than 5,000 psi.

12. A camera module for a vision system for a vehicle, said camera module comprising:

a printed circuit board, said printed circuit board including an imager and associated circuitry disposed at one side of said printed circuit board and electrical connecting elements disposed at the opposite side of said printed circuit board;

a lens mounting element for holding a lens assembly, said lens assembly including at least one optical element;

wherein said lens mounting element is disposed at said printed circuit board and said at least one optical element is optically aligned with said imager of said printed circuit board;

a connector element disposed at and in electrical contact with said electrical connecting elements of said printed circuit board;

a molding formed over and around said printed circuit board and over a portion of said lens mounting element so that said molding and said lens mounting element substantially encase said printed circuit board;

wherein said lens mounting element is adhesively attached at said printed circuit board and wherein the adhesive is at least partially cured before said molding is molded over and around said printed circuit board;

wherein said molding comprises a molded polymer that is injection molded at a molding pressure less than 500 psi, and wherein said molded polymer comprises a thermoset adhesive;

wherein said molding comprises a connector portion that surrounds said connector element, and wherein said connector element is accessible at said connector portion of said molding;

wherein said connector portion is configured to connect to a connector end of a wire harness to electrically connect the connector end of the wire harness to said connector element to establish electrical connection between the wire harness and said electrically connecting elements of said printed circuit board; and

wherein said camera module is configured to be disposed at an exterior portion of a vehicle so as to have a field of view exterior of the vehicle.

13. The camera module of claim 12, wherein said electrical connecting elements of said printed circuit board comprise a plurality of electrically conductive pads electrically connected to circuitry of said printed circuit board, and wherein said connector element comprises a plurality of electrically conductive terminals that electrically connect to said electrically conductive pads when said connector element is disposed at said and in electrical contact with said electrical connecting elements of said printed circuit board.

14. The camera module of claim 12, wherein said molded polymer is molded over a tip feature of said lens mounting element and wherein, when said molded polymer is heated and molded over said tip feature, said tip feature melts and bonds with said molded polymer to create a hermetic seal between said molding and said lens mounting element.

15. The camera module of claim 12, wherein a second molding is molded over said molding to provide an outer shell of said camera module.

16. A method of forming a camera module for a vision system for a vehicle, said method comprising:

providing a circuit board, the circuit board including an imager and associated circuitry disposed at one side of the circuit board and electrical connecting elements disposed at the opposite side of the circuit board;

providing a lens mounting element for holding a lens assembly, the lens assembly including at least one optical element;

positioning the lens mounting element at the circuit board and optically aligning the at least one optical element with the imager of the circuit board;

molding an inner molding over and around the circuit board and over a portion the lens mounting element so that the inner molding and the lens mounting element substantially encase the circuit board;

wherein molding the inner molding comprises molding a first molded polymer at a first molding pressure that is less than 500 psi;

wherein molding the inner molding comprises establishing an aperture at the electrical connecting elements of the circuit board;

providing a connector element at the aperture so as to be in electrical contact with the electrical connecting elements of the circuit board;

molding an outer shell over and around the inner molding and over another portion of the lens mounting element so as to encase the inner molding;

wherein molding the outer shell comprises molding a second molded polymer injection molded at a second molding pressure that is greater than 5,000 psi;

wherein molding the outer shell comprises molding a connector portion that surrounds the connector element, and wherein the connector element is accessible at the connector portion of the outer shell; and

wherein the connector portion is configured to connect to a connector end of a wire harness to electrically connect the connector end of the wire harness to the connector element to establish electrical connection between the wire harness and the electrically connecting elements of the circuit board.

17. The method of claim 16, wherein the electrical connecting elements of the circuit board comprise a plurality of electrically conductive pads electrically connected to circuitry of the circuit board, and wherein the connector element comprises a plurality of electrically conductive terminals that electrically connect to the electrically conductive pads when the connector element is provided at the aperture of the inner molding.

18. The method of claim 16, wherein providing the connector element comprises press fitting the connector element into a receiving structure of the inner molding at the aperture.

19. The method of claim 16, wherein molding the second molded polymer comprises injection molding the second molded polymer over a tip feature of the lens mounting element, and wherein, when the second molded polymer is heated and injection molded, the tip feature melts and bonds with the second molded polymer to create a hermetic seal between the outer shell and the lens mounting element.

20. The method of claim 16, wherein, after positioning the lens mounting element at the circuit board and optically aligning the at least one optical element with the imager of the circuit board, said method comprises adhesively attaching the lens mounting element at the circuit board and at least partially curing the adhesive before molding the inner molding over and around the circuit board.