LIGHT BULB SHAPED LAMP

• US 20170299126A1
• Filed: 06/30/2017
• Published: 10/19/2017
• Est. Priority Date: 07/20/2010
• Status: Active Grant

• Current Assignee: Satco Products Incorporated
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: TAKEUCHI, Nobuyoshi, MATSUDA, Tsugihiro, NAGAI, Hideo, MIKI, Masahiro, KURIMOTO, Yoshitaka
• Granted Patent: US 10,533,712 B2
• Time in Patent Office: Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/235 Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps F21K9/238 takes precedence
• CPC Class Codes: F21K 9/237 Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases F21K9/238 takes precedence
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/66 Details of globes or covers forming part of the light source
• CPC Class Codes: F21V 19/005 by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/08 the material comprising photoluminescent substances
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21V 9/32 characterised by the arrangement of the photoluminescent material
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4903 : Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49107 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 : the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting module includes a base board having a first surface and a second surface opposing the first surface. A plurality of light-emitting diodes is provided on the first surface of the base board. A seal covers the plurality of light-emitting diodes, includes a wavelength conversion material, and covers the second surface of the base board

Claims

1. A light emitting module comprising:

a base board having a first surface and a second surface opposing the first surface;

a plurality of light-emitting diodes provided on the first surface of the base board; and

a seal including a wavelength conversion material, the seal covering the plurality of light-emitting diodes and covering the second surface of the base board.

2. The light emitting module according to claim 1, wherein

the seal further includes a translucent material.

3. The light emitting module according to claim 1, wherein

the seal covers the first surface of the base board.

4. The light emitting module according to claim 1, wherein

the plurality of light-emitting diodes is arranged in a straight line, and

the seal is arranged in a continuous straight line on a row of the plurality of light-emitting diodes.

5. The light emitting module according to claim 1, wherein

the plurality of light-emitting diodes is not mounted on the second surface of the base board.

6. The light emitting module according to claim 1, wherein

the base board, the plurality of light-emitting diodes, and the seal comprise a light emitter configured to reproduce a simulated light-emitting property equivalent to a filament in an incandescent light bulb.

7. The light emitting module according to claim 1, further comprising

a first power supply terminal provided on one end of the base board and a second power supply terminal provided on another end of the base board.

8. The light emitting module according to claim 1, wherein

each of the plurality of light-emitting diodes includes a sapphire board and a plurality of nitride semiconductor layers stacked on the sapphire board, and is fixed on the base board with the sapphire board facing the first surface of the base board.

9. The light emitting module according to claim 1, wherein

the plurality of light-emitting diodes is fixed on the base board by a translucent bonding material.

10. The light emitting module according to claim 1, wherein

the plurality of light-emitting diodes is connected in series by wires, and

each of the wires connects one of the plurality of light-emitting diodes to an adjacent one the plurality of light-emitting diodes.

11. The light emitting module according to claim 10, wherein

a direction of each of the wires extends in a longitudinal direction of the base board, and each of the wires is covered by the seal.

12. The light emitting module according to claim 1, wherein

the base board has a length and a width and one of the length and the width is longer than another of the length and the width.

13. The light emitting module according to claim 12, wherein

the base board is longer than it is wide.

14. The light emitting module according to claim 1, wherein

the seal comprises a continuous line of sealing material.

15. The light emitting module according to claim 13, wherein

the sealing material is dome-shaped in cross-section.

16. The light emitting module according to claim 13, wherein

a width of the sealing material approximates a width of the base board.

17. The light emitting module according to claim 13, wherein

a width of the sealing material is longer than a height of the sealing material in cross section.