HEARING AID ADAPTED FOR EMBEDDED ELECTRONICS
First Claim
Patent Images
1. A hearing aid comprising:
- a microphone;
a receiver;
hearing aid electronics coupled to the microphone and the receiver; and
conductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator.
2 Assignments
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Accused Products
Abstract
A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
10 Citations
20 Claims
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1. A hearing aid comprising:
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a microphone; a receiver; hearing aid electronics coupled to the microphone and the receiver; and conductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a hearing aid, the method comprising:
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providing a housing for the hearing aid, the housing including integrated electrical components embedded within a sidewall of the housing; and providing multi-axis conductive traces along contours of the sidewall of the housing using Molded Interconnect Device (MID) technology, the conductive traces overlaying an insulator and following non-planar contours of the insulator, the conductive traces configured to connect the integrated electrical components to hearing aid electronics within the housing using the conductive traces. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification