Connecting an Electronic Component to an Interactive Textile

• US 20170325337A1
• Filed: 11/15/2016
• Published: 11/09/2017
• Est. Priority Date: 05/03/2016
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google Inc. (Alphabet Inc.)
• Inventors: Karagozler, Mustafa Emre, Poupyrev, Ivan, Gong, Nan-Wei, Robinson, Karen Elizabeth, Hayes-Danitz, Patricia, Grant, Megan
• Granted Patent: US 10,492,302 B2
• Time in Patent Office: Days
• CPC Class Codes: A41D 1/005 with embedded cable or connector
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 11/00 Double or multi-ply fabrics not otherwise provided for
• CPC Class Codes: D03D 25/005 Three-dimensional woven fabrics
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/0447 Position sensing using the local deformation of sensor cells
• CPC Class Codes: H01R 43/005 for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
• CPC Class Codes: H01R 43/28 for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 3/34 by soldering
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer.

Claims

1. A method for connecting an electronic component to an interactive textile, the method comprising:

collecting and organizing loose conductive threads of the interactive textile into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component;

stripping non-conductive material of the conductive threads of the ribbon to expose conductive wires of the conductive threads;

bonding the connection points of the electronic component to the exposed conductive wires of the ribbon;

sealing the conductive threads at the base of the ribbon with an epoxy; and

encapsulating the electronic component and the ribbon with a water-resistant material.

2. The method of claim 1, wherein the collecting and organizing comprises collecting and organizing the loose conductive threads with a comb tool that includes openings that are spaced based on the corresponding pitch of the connection points.

3. The method of claim 2, further comprising forming the ribbon by:

arranging the loose conductive threads within the openings of the comb tool;

placing a film over the arranged conductive threads within the comb tool; and

applying heat to the film to secure the arranged conductive threads.

4. The method of claim 2, wherein the pitch of the comb tool is mechanically-adjustable.

5. The method of claim 1, wherein the stripping non-conductive material of the conductive threads of the ribbon comprises applying a hot blade to the conductive threads of the ribbon to melt or burn the non-conductive material from the conductive threads of the ribbon.

6. The method of claim 5, wherein a temperature of the hot blade configured to melt or burn the non-conductive material of the conductive threads without melting or burning the conductive wires of the conductive threads.

7. The method of claim 1, wherein the stripping non-conductive material of the conductive threads of the ribbon comprises applying a laser beam to the conductive threads of the ribbon to abate the non-conductive material from the conductive threads of the ribbon.

8. The method of claim 7, wherein an absorption of the laser is low to cause the laser beam to abate the non-conductive material of the conductive threads without abating the conductive wires of the conductive threads.

9. The method of claim 1, wherein the bonding connection points of the electronic component to the exposed conductive wires of the ribbon further comprises:

aligning the exposed conductive wires of the ribbon with the connection points of the electronic component; and

pressing a hot bar with solder against the exposed conductive wires and the connection points to cause each exposed conductive wire to bond to a respective connection point of the electronic component.

10. The method of claim 1, wherein the sealing the conductive threads at the base of the ribbon with an epoxy comprises:

applying the epoxy to each of the conductive threads at the base of the ribbon; and

curing the epoxy with UV light or heat.

11. The method of claim 10, wherein the epoxy is simultaneously applied to each of the conductive threads at the base of the ribbon using a multi-head nozzle.

12. The method of claim 10, wherein the epoxy is individually applied to each of the conductive threads at the base of the ribbon using a single-head nozzle.

13. The method of claim 1, wherein the encapsulating the electronic component and the ribbon with a water-resistant material comprises:

placing the electronic component and the ribbon into a mold;

applying the water-resistant material to the mold such that the water-resistant material hardens around the electronic component and the ribbon.

14. The method of claim 13, wherein the water-resistant material comprises a plastic or a polymer.

15. The method of claim 1, wherein the electronic component comprises a flexible circuit board.

16. The method of claim 1, wherein the conductive wires comprises copper wires.

17. A system for connecting an electronic component to an interactive textile, the system comprising:

a ribbonization component comprising a comb tool and a heating element, the ribbonization component configured to collect and organize loose conductive threads of the interactive textile using the comb tool and press the heating element over a film placed over the organized conductive threads in the comb tool to form a ribbon;

a stripping component configured comprising a hot blade, the stripping component configured to apply the hot blade to the organized conductive threads in the comb tool to strip non-conductive material from the conductive threads to expose conductive wires of the conductive threads; and

a bonding component comprising a hot bar, the bonding component configured to press the hot bar prepped with solder against the exposed conductive wires and the connection points to cause each exposed conductive wire to bond to a respective connection point of the electronic component.

18. The system of claim 17, wherein the comb tool includes openings that are spaced based on a corresponding pitch of the connection points.

19. The system of claim 17, further comprising a sealing component, the sealing component configured to apply epoxy to each of the conductive threads at the base of the ribbon and cure the epoxy with UV light or heat to seal the conductive threads at the base of the ribbon.

20. The system of claim 17, further comprising an encapsulation component configured to place the electronic component and the ribbon into a mold and apply a water resistant-material to the mold such that the water-resistant material hardens and forms an encapsulation around the electronic component and the ribbon.