PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

• US 20170345961A1
• Filed: 05/25/2017
• Published: 11/30/2017
• Est. Priority Date: 05/27/2016
• Status: Active Grant

• Current Assignee: Silergy Semiconductor Technology (Hangzhou) Ltd. (Silergy Corporation)
• Original Assignee: Silergy Semiconductor Technology (Hangzhou) Ltd. (Silergy Corporation)
• Inventors: Shentu, Junli, Ye, Jiaming
• Granted Patent: US 10,333,019 B2
• Time in Patent Office: Days
• CPC Class Codes: G01J 1/0209 Monolithic
• CPC Class Codes: G01J 1/0214 Constructional arrangements for removing stray light
• CPC Class Codes: G01J 1/0271 Housings; Attachments or accessories for photometers
• CPC Class Codes: G01J 1/0488 with spectral filtering
• CPC Class Codes: G01J 1/4204 with determination of ambient light solar light G01J2001/4266
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: H01L 31/00 Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof H10K30/00 takes precedence; devices consisting of a plurality of solid state components formed in, or on, a common substrate, other than combinations of radiation-sensitive components with one or more electric light sources, H01L27/00
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H01L 31/02165 using interference filters, e.g. multilayer dielectric filters interference filters G02B5/28
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

Disclosed is a package structure and a method for manufacturing the same. The package structure comprises: a lead frame; a first light sensor being electrically coupled to the lead frame; a light emitter separated from the first light sensor and being electrically coupled to the lead frame; a first plastic body in which a trench is formed; and a photoresist layer located on a side surface of the first plastic body, wherein the first plastic body is separated by the trench into a first portion covering the light emitter and a second portion covering the first light sensor, the first portion of the first plastic body has the side surface facing the first light sensor. The photoresist layer prevents the light with a specific wavelength from passing through and avoids the influence to the normal operation of the light sensor, so that the anti-interference capacity of the light sensor is ensured and the size of package structure is reduced while the light sensor is integrated.

Claims

1. A package structure, comprising:

a lead frame;

a first light sensor being electrically coupled to said lead frame;

a light emitter separated from said first light sensor and being electrically coupled to said lead frame;

a first plastic body in which a trench is formed; and

a photoresist layer located on a side surface of said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has said side surface facing said first light sensor.

2. The package structure according to claim 1, further comprising:

a second light sensor being electrically coupled to said lead frame.

3. The package structure according to claim 2, wherein

said first light sensor is an ambient light sensor, on which an ambient light sensitive region is provided to detect ambient light;

and

said second light sensor is an infrared light sensor, on which an infrared light sensitive region is provided to detect infrared light; and

said light emitter is an infrared light emitter.

4. The package structure according to claim 3, wherein

said first plastic body is a transparent plastic body;

and

said photoresist layer is an infrared photoresist layer that prevents infrared light from passing through.

5. The package structure according to claim 3, wherein a first filter film is provided on said ambient light sensitive region of said ambient light sensor, which is an infrared cutoff filter film.

6. The package structure according to claim 3, wherein a second filter film is provided on said infrared light sensitive region of said infrared light sensor, which allows only infrared light to pass through.

7. The package structure according to claim 4, wherein said portions of said first plastic body on said ambient light sensor, said infrared light sensor, and said infrared light emitter may optionally have arcuate projections.

8. The package structure according to claim 4, further comprising:

a second plastic body made of infrared cutoff materials and covering said rest portion of said infrared light sensor except for said infrared light sensitive region.

9. The package structure according to claim 1, wherein said lead frame comprises:

a plurality of inner pins being coupled to said first light sensor and said light emitter; and

a plurality of outer pins being exposed outside said first plastic body.

10. The package structure according to claim 9, further comprising:

a third plastic body,

wherein there are gaps between said plurality of inner pins and said gaps are filled with said third plastic body.

11. The package structure according to claim 10, wherein said third plastic body is made of infrared cutoff materials.

12. A method for manufacturing a package structure, comprising:

providing a lead frame;

mounting a first light sensor and a light emitter, which are mounted separately but both electrically coupled to said lead frame;

forming a first plastic body which covers all or part of said first light sensor and said light emitter;

forming a trench in said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has a side surface facing said first light sensor;

forming a light photoresist layer on said side surface.

13. The method according to claim 12, further comprising:

mounting a second light sensor being electrically coupled to said lead frame.

14. The method according to claim 13, wherein said second light sensor is mounted while said first light sensor and said light emitter are mounted.

15. The method according to claim 14, wherein said second light sensor is mounted in superposed manner on said first light sensor.

16. The method according to claim 12, wherein said second light sensor is mounted after said first plastic body is formed.

17. The method according to claim 16, wherein a second plastic body is formed covering said second light sensor after said second light sensor is mounted.

18. The method according to claim 17, wherein said trench extends into said second plastic body.

19. The method according to claim 12, wherein said step of forming said first plastic body comprises forming arcuate projections over said first light sensor and/or said light emitter.

20. The method according to claim 13, wherein said electric coupling is implemented by coupling electrodes of said first light sensor or said second light sensor or said light emitter to inner pins of said lead frame via electric connectors.

21. The method according to claim 13, wherein said electric coupling is implemented by placing electrodes of said first light sensor or said second light sensor or said light emitter towards inner pins of said lead frame and welding to said inner pins.

22. The method according to claim 15, wherein said electric coupling between said second light sensor and said lead frame is implemented by conductive vias provided on said first light sensor.

23. The method according to claim 12, wherein said materials of said first plastic body are filled between said photoresist layer and said second portion of first plastic body to form a complete first plastic body.