LIGHT SOURCE DEVICE

• US 20180006000A1
• Filed: 08/28/2017
• Published: 01/04/2018
• Est. Priority Date: 04/10/2013
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Chen, Cheng-Yen, Li, Yun-Li, Su, Po-Jen
• Granted Patent: US 10,224,315 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 24/14 of a plurality of bump connectors
• CPC Class Codes: H01L 25/04 the devices not having separate containers
• CPC Class Codes: H01L 25/042 the devices being arranged next to each other solar cells H01L31/042
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 25/112 Mixed assemblies
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 59/32 Stacked devices having two or more layers, each emitting at different wavelengths

Abstract

A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

Claims

1. A light source device, comprising:

a substrate having an upper surface;

at least one first light-emitting diode (LED) chip disposed on the upper surface and electrically connected to the substrate; and

at least one second LED chip disposed on the upper surface and electrically connected to the substrate, wherein a first distance from the upper surface to a top surface of the at least one first LED chip is higher than a second distance from the upper surface to a top surface of the at least one second LED chip, and a thickness of the at least one second LED chip is different from a thickness of the at least one first LED chip.

2. The light source device as recited in claim 1, wherein the at least one first LED chip comprises a first chip substrate, the at least one second LED chip comprises a second chip substrate, and a thickness of the second chip substrate is different from a thickness of the first chip substrate.

3. The light source device as recited in claim 2, wherein the thickness of the at least one second chip substrate is between a magnitude of 1 and 1+Scot(θ

/2)/d″

of the thickness of the at least one first chip substrate, wherein S is a spacing of the at least one first LED chip and the at least one second LED chip, d″

is a thickness of the at least one first chip substrate, and θ

is a beam angle of the at least one first LED chip.

4. The light source device as recited in claim 3, wherein the first distance is D1, the second distance is D2, where D1 and D2 satisfy the following formula:

D1<

D2<

D1·

[1+Scot(θ

/2)/d].

5. The light source device as recited in claim 1, wherein the at least one first LED chip or the at least one second LED chip is flipped on the substrate.