COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP

• US 20180007759A1
• Filed: 04/13/2017
• Published: 01/04/2018
• Est. Priority Date: 11/26/2014
• Status: Active Grant

• Current Assignee: Ledengin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao, Lee, Kachun
• Granted Patent: US 10,172,206 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 45/22 using optical feedback
• CPC Class Codes: H05B 45/28 using temperature feedback
• CPC Class Codes: H05B 47/105 in response to determined parameters

Abstract

A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Claims

1-2. -2. (canceled)

3. An LED emitter comprising:

a substrate having;

a body with a recess region formed therein;

a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads;

an external power contact disposed outside the recess region;

a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external power contact to at least one of the supporting chip bonding pads and connecting a first subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs;

a plurality of LEDs disposed in the recess region and connected to the LED bonding pads;

a supporting chip disposed in the recess region and connected to the supporting chip bonding pads, the supporting chip including a driver circuit to generate different operating currents for the different ones of the LEDs and a control circuit to control operation of the driver circuit in response to an external control signal; and

an optically transparent cover disposed over and sealed to the recess region.

4. The LED emitter of claim 3 wherein the electrical paths connect the LEDs into at least three independently addressable groups, each group connected to receive operating current from the driver circuit of the supporting chip via a different one of the supporting chip bonding pads.

5. The LED emitter of claim 3 wherein the supporting chip further includes a wireless communication interface to receive the external control signal and to provide the external control signal to the control circuit.

6. The LED emitter of claim 3 wherein:

the plurality of bonding pads further includes one or more external bonding pads disposed outside the recess region;

the plurality of electrical paths further includes one or more paths connecting the one or more external bonding pads to one or more of the supporting chip bonding pads; and

the control circuit of the supporting chip receives the external control signal via the one or more external bonding pads.

7. The LED emitter of claim 3 wherein the supporting chip further includes a programmable read-only memory to store a mapping between each of a plurality of states of the external control signal and a corresponding distribution of operating currents to be generated by the driver circuit.

8. The LED emitter of claim 7 wherein the programmable read-only memory is configured to be programmed during a calibration operation.

9. The LED emitter of claim 3 wherein:

the plurality of bonding pads further includes one or more calibration input pads disposed outside the recess region;

the plurality of electrical paths further includes one or more paths connecting the one or more calibration input pads to one or more of the supporting chip bonding pads; and

the driver circuit is further configured to operate in response to signals received via the calibration input pads during a calibration operation.

10. The LED emitter of claim 3 further comprising:

a temperature sensor disposed within the LED emitter and coupled to the supporting chip,

wherein the control circuit is further configured to control the operation of the driver circuit based in part on temperature inputs received from the temperature sensor.

11. The LED emitter of claim 3 further comprising:

an environmental sensor coupled to the supporting chip,

wherein the control circuit is further configured to control the operation of the driver circuit based in part on inputs received from the environmental sensor.

12. The LED emitter of claim 11 wherein the environmental sensor includes at least one of an ambient light sensor or an occupancy sensor.

13. The LED emitter of claim 11 wherein the environmental sensor is disposed on an outer surface of the LED emitter.

14. The LED emitter of claim 3 wherein the supporting chip further includes a temperature sensor and wherein the control circuit is further configured to control the operation of the driver circuit based in part on temperature inputs received from the temperature sensor.

15. An LED emitter comprising:

a substrate having;

a body with a recess region formed therein;

a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads, a plurality of microcontroller unit bonding pads, and a plurality of driver unit bonding pads;

an external power contact disposed outside the recess region; and

a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting at least a subset of the microcontroller unit bonding pads to a first subset of the driver unit bonding pads, connecting the external power contact to at least one of the driver unit bonding pads, and connecting a second subset of the driver unit bonding pads to the plurality of LED bonding pads such that a driver unit connected to the driver unit bonding pads is operable to deliver different operating currents to different ones of the LEDs in response to internal control signals received from the microcontroller unit;

a plurality of LEDs disposed in the recess region and connected to the LED bonding pads;

a microcontroller unit disposed in the recess region and connected to the microcontroller unit bonding pads;

a driver unit disposed in the recess region and connected to the driver unit bonding pads; and

an optically transparent cover disposed over and sealed to the recess region.

16. The LED emitter of claim 15 wherein the electrical paths connect the LEDs into at least three independently addressable groups, each group connected to receive current from the driver unit via a different one of the driver unit bonding pads.

17. The LED emitter of claim 15 wherein the microcontroller unit includes a wireless communication interface to receive an external control signal and wherein the microcontroller unit generates the internal control signals to the driver unit in response to the external control signal.

18. The LED emitter of claim 15 wherein:

the plurality of bonding pads further includes one or more external bonding pads disposed outside the recess region;

the plurality of electrical paths further includes one or more paths connecting the one or more external bonding pads to one or more of the microcontroller unit bonding pads; and

the microcontroller unit generates the internal control signals to the driver unit in response to an external control signal received at the one or more external bonding pads.

19. The LED emitter of claim 15 wherein the microcontroller unit further includes a programmable read-only memory to store a mapping between each of a plurality of states of an external control signal received by the microcontroller unit and a corresponding distribution of operating currents to be generated by the driver unit.

20. The LED emitter of claim 19 wherein the programmable read-only memory is configured to be programmed during a calibration operation.

21. The LED emitter of claim 15 further comprising:

a programmable read-only memory chip to store a mapping between each of a plurality of states of an external control signal received by the microcontroller unit and a corresponding distribution of operating currents to be generated by the driver unit,

wherein the plurality of electrical paths further includes one or more electrical paths coupling the programmable read-only memory chip to the microcontroller unit.

22. The LED emitter of claim 15 wherein:

the plurality of bonding pads further includes one or more calibration input pads disposed outside the recess region;

the plurality of electrical paths further includes one or more paths connecting the one or more calibration input pads to one or more of the driver unit bonding pads; and

the driver unit is further configured to operate in response to signals received via the calibration input pads during a calibration operation.

23. The LED emitter of claim 15 further comprising:

a temperature sensor disposed within the LED emitter and coupled to the microcontroller unit,

wherein the microcontroller unit is further configured to generate the internal control signals for the driver unit based in part on temperature inputs received from the temperature sensor.

24. The LED emitter of claim 15 further comprising:

an environmental sensor coupled to the microcontroller unit,

wherein the microcontroller unit is further configured to generate the internal control signals for the driver unit based in part on inputs received from the environmental sensor.

25. The LED emitter of claim 24 wherein the environmental sensor includes at least one of an ambient light sensor or an occupancy sensor.