BIOSENSOR

• US 20180008177A1
• Filed: 02/01/2017
• Published: 01/11/2018
• Est. Priority Date: 08/19/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: SHIMUTA, TORU, Fujii, Yasutaka
• Granted Patent: US 10,314,526 B2
• Time in Patent Office: Days
• CPC Class Codes: A61B 2562/0233 Special features of optical sensors or probes classified in A61B5/00
• CPC Class Codes: A61B 5/0245 by using sensing means generating electric signals, i.e. ECG signals
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/688 using adhesives

Abstract

A biosensor including light emitting elements and a light receiving element disposed on a principal surface of a wiring board; a light shielding portion disposed between a light-emitting-element sealing portion and a light-receiving-element sealing portion; a base medium having light transmitting properties, disposed in parallel with the wiring board with the light shielding portion therebetween; an adhesion layer having light transmitting properties that bonds the base medium with the light-emitting-element sealing portion, the light-receiving-element sealing portion, and the light shielding portion; and a first electrocardiograph electrode attached to a principal surface of the base medium. Both end portions of the adhesion layer and both end portions of the base medium are disposed such that they overlap neither of the light-receiving-element sealing portion nor the light-emitting-element sealing portion when viewed from a direction normal to the principal surface of the wiring board.

Claims

1. A biosensor comprising:

a wiring board having a principal surface;

a light emitting element and a light receiving element disposed on the principal surface of the wiring board;

a light-emitting-element sealer disposed on the principal surface of the wiring board to seal the light emitting element;

a light-receiving-element sealer disposed on the principal surface of the wiring board to seal the light receiving element;

a light shielding portion disposed between the light-emitting-element sealer and the light-receiving-element sealer;

a base medium with light transmitting properties disposed above the wiring board with the light shielding portion therebetween;

an adhesion layer with light transmitting properties disposed on at least one of the light shielding portion, the light-emitting-element sealer and the light-receiving-element sealer, wherein the adhesion layer bonds the base medium to the at least one of the light shielding portion, the light-emitting-element sealer portion and the light-receiving-element sealer; and

a plane electrode disposed on the base medium, wherein the plane electrode does not intersect either a line extending in a direction normal to the principal surface of the wiring board and through the light emitting element or a line extending in the direction normal to the principal surface of the wiring board and through the light receiving element,

wherein end portions of the adhesion layer and end portions of the base medium each do not overlap the light-receiving-element sealer, when viewed from the direction normal to the principal surface of the wiring board, or the end portions of the adhesion layer and end portions of the base medium each do not overlap the light-emitting-element sealer, when viewed from the direction normal to the principal surface of the wiring board.

2. The biosensor according to claim 1, wherein the plane electrode is configured to monitor a potential of a body.

3. The biosensor according to claim 1, wherein the plane electrode extends a length on the base medium such that the plane electrode is between the light emitting element and the light receiving element when viewed from the direction normal to the principal surface of the wiring board.

4. The biosensor according to claim 1, wherein the adhesion layer and the base medium do not overlap both the light-emitting-element sealer and the light-receiving-element sealer when viewed from the direction normal to the principal surface of the wiring board.

5. The biosensor according to claim 1, wherein the light emitting element comprises a pair of light emitting devices configured to emit light beams at different wavelengths.

6. The biosensor according to claim 5, wherein the pair of light emitting devices emit light in an infrared light range and a red light range, respectively.

7. The biosensor according to claim 1, wherein the light shielding portion comprises a rectangular parallelepiped shape on the principal surface of the wiring board.

8. The biosensor according to claim 1,

wherein a first end portion of the adhesion layer coincides with a lateral surface of the light-emitting-element sealer, and

wherein a second end portion of the adhesion layer coincides with a lateral surface of the light-receiving-element sealer.

9. The biosensor according to claim 1,

wherein a first end portion of the adhesion layer coincides with a lateral surface of the light-emitting-element sealer, and

wherein a second end portion of the adhesion layer overlaps the light receiving element when viewed from the direction normal to the principal surface of the wiring board.

10. The biosensor according to claim 9, wherein the second end portion of the adhesion layer overlaps a centerline of the light receiving element when viewed from the direction normal to the principal surface of the wiring board.

11. The biosensor according to claim 1, wherein a distance from the light emitting element to the light receiving element is between 4 mm and 20 mm.

12. A biosensor comprising:

a wiring board having a principal surface;

a light emitting element and a light receiving element disposed on the principal surface of the wiring board;

a light-emitting-element sealer having light transmitting properties and disposed on the principal surface of the wiring board to seal the light emitting element;

a light-receiving-element sealer having light transmitting properties and disposed on the principal surface of the wiring board to seal the light receiving element;

a light shielding portion disposed between the light-emitting-element sealer and the light-receiving-element sealer; and

a cover with light transmitting properties disposed in parallel with the wiring board with the light shielding portion therebetween,

wherein the cover is disposed such that end portions of the cover do not intersect a line extending in a direction normal to the principal surface of the wiring board and through the light emitting element or the end portions of the cover do not intersect a line extending in the direction normal to the principal surface of the wiring board and through the light receiving element.

13. The biosensor according to claim 12, wherein the cover comprises a first end portion adjacent to the light receiving element and a second end portion adjacent to the light emitting element.

14. The biosensor according to claim 13, wherein a lateral surface of the first end portion of the cover does not intersect a line extending in a direction from a light receiving portion of the light receiving element through a peripheral portion of an opening of the light-receiving-element sealer.

15. The biosensor according to claim 13, wherein a lateral surface of the second end portion of the cover does not intersect a line extending in a direction from a light emitting portion of the light emitting element through a peripheral portion of an opening of the light-emitting-element sealer.

16. The biosensor according to claim 12, wherein the light emitting element comprises a pair of light emitting devices configured to emit light beams at different wavelengths.

17. The biosensor according to claim 16, wherein the pair of light emitting devices emit light in an infrared light range and a red light range, respectively.

18. The biosensor according to claim 12, wherein the cover comprises an inverted U shape cross section having an opening facing downward.

19. A biosensor comprising:

a wiring board having a principal surface;

a light emitting element and a light receiving element disposed on the principal surface of the wiring board;

a light-emitting-element sealer disposed on the principal surface of the wiring board to seal the light emitting element;

a light-receiving-element sealer disposed on the principal surface of the wiring board to seal the light receiving element;

a light shielding portion disposed between the light-emitting-element sealer and the light-receiving-element sealer;

a base medium with light transmitting properties disposed above the wiring board with the light shielding portion therebetween; and

an adhesion layer with light transmitting properties disposed on at least one of the light shielding portion, the light-emitting-element sealer and the light-receiving-element sealer, wherein the adhesion layer bonds the base medium to the at least one of the light shielding portion, the light-emitting-element sealer portion and the light-receiving-element sealer,

wherein respective end portions of the adhesion layer and end portions of the base medium each closer to the light receiving element do not overlap the light-receiving-element sealer, when viewed from a direction normal to the principal surface of the wiring board.

20. A biosensor comprising:

a wiring board having a principal surface;

a light emitting element and a light receiving element disposed on the principal surface of the wiring board;

a light-emitting-element sealer disposed on the principal surface of the wiring board to seal the light emitting element;

a light-receiving-element sealer disposed on the principal surface of the wiring board to seal the light receiving element;

a light shielding portion disposed between the light-emitting-element sealer and the light-receiving-element sealer;

a base medium with light transmitting properties disposed above the wiring board with the light shielding portion therebetween; and

an adhesion layer with light transmitting properties disposed on at least one of the light shielding portion, the light-emitting-element sealer and the light-receiving-element sealer, wherein the adhesion layer bonds the base medium to the at least one of the light shielding portion, the light-emitting-element sealer portion and the light-receiving-element sealer,

wherein respective end portions of the adhesion layer and end portions of the base medium each closer to the light emitting element do not overlap the light-emitting-element sealer, when viewed from a direction normal to the principal surface of the wiring board.