Qubit and Coupler Circuit Structures and Coupling Techniques
First Claim
Patent Images
1. A cryogenic quantum bit package comprising:
- (a) one or more quantum bit (qubit) integrated circuits, each of said one or more qubit integrated circuits comprising at least two qubit circuits;
(b) a quantum bit bias control line;
(c) a coupler circuit disposed to couple signals between said at least two qubit circuits;
(d) a superconducting multi-chip module (MCM); and
(e) one or more superconducting and/or nearly superconducting interconnects, each of said one or more superconducting interconnects disposed between and electrically coupled to said one or more quantum bit integrated circuits and said superconducting MCM such that a signal path is provided between said one or more qubit integrated circuits and said MCM.
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Abstract
Quantum bit (qubit) circuits, coupler circuit structures and coupling techniques are described. Such circuits and techniques may be used to provide multi-qubit circuits suitable for use in multichip modules (MCMs).
104 Citations
21 Claims
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1. A cryogenic quantum bit package comprising:
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(a) one or more quantum bit (qubit) integrated circuits, each of said one or more qubit integrated circuits comprising at least two qubit circuits; (b) a quantum bit bias control line; (c) a coupler circuit disposed to couple signals between said at least two qubit circuits; (d) a superconducting multi-chip module (MCM); and (e) one or more superconducting and/or nearly superconducting interconnects, each of said one or more superconducting interconnects disposed between and electrically coupled to said one or more quantum bit integrated circuits and said superconducting MCM such that a signal path is provided between said one or more qubit integrated circuits and said MCM. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A cryogenic quantum bit package comprising:
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a first quantum bit (qubit) integrated circuit; a second quantum bit integrated circuit; a superconducting multi-chip-module (MOM); an interposer disposed between said first and second quantum bit integrated circuits and said superconducting MCM, said interposer comprising a TSV substrate and disposed to electrically interconnect said first and second quantum bit integrated circuits to said superconducting MCM sandwich. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification