PACKAGING ADHESIVE, PACKAGING METHOD, DISPLAY PANEL AND DISPLAY DEVICE

• US 20180013091A1
• Filed: 04/15/2016
• Published: 01/11/2018
• Est. Priority Date: 05/07/2015
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Inventors: YIN, Chuan, CHANG, Chia Hao, XIONG, Xianjiang
• Granted Patent: US 10,707,439 B2
• Time in Patent Office: Days
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing

Abstract

The present disclosure provides a packaging adhesive, a packaging method, a display panel, and a display device. The packaging adhesive includes a frit, an organic solvent, and a material with a thermal expansion coefficient larger than that of the frit. Using the packaging adhesive provided by the present disclosure, the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced by doping the material with a thermal expansion coefficient larger than that of the frit into existing glass cement, so that in a packaging process using laser radiation, an expansion volume of the packaging adhesive when heated is increased. In this way, a gap between the packaging adhesive and an array substrate is effectively reduced, and a packaging effect is improved.

Claims

1. A packaging adhesive comprising a frit and an organic solvent, wherein the packaging adhesive further comprises a material with a thermal expansion coefficient larger than that of the frit.

2. The packaging adhesive according to claim 1, wherein the frit is borosilicate glass and the material with a thermal expansion coefficient larger than that of the frit is quartz.

3. The packaging adhesive according to claim 2, wherein in the packaging adhesive, a mass ratio of the quartz to the borosilicate glass ranges from 3:

7 to 4;

6.

4. A packaging method, comprising:

applying the packaging adhesive according to claim 1 to a packaging area of a first glass substrate; and

attaching the first glass substrate to a second glass substrate.

5. The packaging method according to claim 4, wherein:

applying the packaging adhesive further comprises removing the organic solvent by heating the packaging adhesive to form a packaging layer on the packaging area; and

attaching the first glass substrate further comprises irradiating the packaging layer using a laser to form a sealing structure between the first glass substrate and the second glass substrate.

6. The packaging method according to claim 5, wherein the applying the packaging adhesive further comprises:

applying at least two layers of the packaging adhesive in sequence to the packaging area of the first glass substrate, each layer of the packaging adhesive forming one packaging layer after the organic solvent is removed by heating, so as to form at least two packaging layers in stack, wherein for any two packaging layers, a thermal expansion coefficient of the packaging layer formed by the packaging adhesive applied earlier is greater than that of the packaging layer formed by the packaging adhesive applied later.

7. The packaging method according to claim 6, wherein two packaging layers in stack are formed when applying the packaging adhesive, wherein the thermal expansion coefficient of the packaging layer formed by the packaging adhesive applied earlier ranges from 80×

10<sup>−

7</sup>/°

C. to 25−

10<sup>−

6</sup>/°

C., and wherein the thermal expansion coefficient of the packaging layer formed by the packaging adhesive applied later ranges from 30×

10<sup>−

7</sup>/°

C. to 40×

10<sup>−

7</sup>/°

C.

8. The packaging method according to claim 7, wherein a volume ratio of the packaging layer formed by the packaging adhesive applied later to the packaging layer formed by the packaging adhesive applied earlier is greater than or equal to 5:

1.

9. The packaging method according to claim 8, wherein the volume ratio of the packaging layer formed by the packaging adhesive applied later to the packaging layer formed by the packaging adhesive applied earlier is 6:

1.

10. A display panel comprising a first glass substrate and a second glass substrate arranged opposite one another, wherein a sealing structure formed using the packaging adhesive according to claim 1 is arranged between the first glass substrate and the second glass substrate.

11. The display panel according to claim 10, wherein the sealing structure comprises at least two packaging layers in stack, wherein the at least two packaging layers in stack are formed by applying, in sequence, a corresponding number of layers of the packaging adhesive to the packaging area of the first glass substrate and heating, and wherein for any two of the packaging players in the sealing structure, a thermal expansion coefficient of the packaging layer formed by the packaging adhesive applied earlier is greater than that of the packaging layer formed by the packaging adhesive applied later.

12. A display device comprising the display panel according to claim 10.

13. A display device, comprising the display panel according to claim 11.

14. A display panel comprising a first glass substrate and a second glass substrate arranged opposite one another, wherein a sealing structure formed using the packaging adhesive according to claim 2 is arranged between the first glass substrate and the second glass substrate.

15. A display panel comprising a first glass substrate and a second glass substrate arranged opposite one another, wherein a sealing structure formed using the packaging adhesive according to claim 3 is arranged between the first glass substrate and the second glass substrate.

16. A packaging method comprising:

applying the packaging adhesive according to claim 2 to a packaging area of a first glass substrate; and

attaching the first glass substrate to a second glass substrate.

17. A packaging method comprising:

applying the packaging adhesive according to claim 3 to a packaging area of a first glass substrate; and

attaching the first glass substrate to a second glass substrate.