NOISE CANCELLATION FOR A MAGNETICALLY COUPLED COMMUNICATION LINK UTILIZING A LEAD FRAME

• US 20180040570A1
• Filed: 10/19/2017
• Published: 02/08/2018
• Est. Priority Date: 11/14/2012
• Status: Active Grant

• Current Assignee: Power Integrations Incorporated
• Original Assignee: Power Integrations Incorporated
• Inventors: Kung, David, Matthews, David Michael Hugh, Balakrishnan, Balu
• Granted Patent: US 10,224,292 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H04B 15/005 Reducing noise, e.g. humm, from the supply
• CPC Class Codes: H05K 7/14 Mounting supporting structure in casing or on frame or rack

Abstract

An integrated circuit package includes a portion of a lead frame disposed within an encapsulation. The lead frame includes a first conductor including a first conductive loop and a third conductive loop disposed substantially within the encapsulation. A second conductor formed in the lead frame is galvanically isolated from the first conductor and includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors. The third conductive loop is wound in an opposite direction relative to the first conductive loop. A transmit circuit is disposed within the encapsulation and is coupled to the second conductor to provide a transmitter current. A receive circuit is disposed within the encapsulation and is coupled to the first conductor to receive a transmitter induced signal in response to the transmitter current.

Claims

1. An integrated circuit package, comprising:

an encapsulation; and

a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising;

a first conductor formed in the lead frame including a first conductive loop and a third conductive loop disposed substantially within the encapsulation; and

a second conductor formed in the lead frame galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors,

wherein the third conductive loop is wound in an opposite direction relative to the first conductive loop in the encapsulation;

a transmit circuit disposed within the encapsulation, wherein the transmit circuit is coupled to the second conductor and is coupled to provide a transmitter current; and

a receive circuit disposed within the encapsulation, wherein the receive circuit is coupled to the first conductor and is coupled to receive a transmitter induced signal in response to the transmitter current.

2. The integrated circuit package of claim 1, wherein the second conductive loop is magnetically coupled to the first conductive loop to provide the communication link between the first and second conductors.

3. The integrated circuit package of claim 1, wherein when the integrated circuit package is subjected to an external magnetic field, a first noise signal component induced in the first conductive loop in response to the external magnetic field is opposite to a second noise signal component induced in the third conductive loop in response to the external magnetic field.

4. The integrated circuit package of claim 3, wherein a sum of the first and second noise signal components in the first conductor in response to the external magnetic field is substantially equal to zero.

5. The integrated circuit package of claim 1, wherein the first conductive loop is wound in a counter-clockwise direction and the third conductive loop in a clockwise direction.

6. The integrated circuit package of claim 1, wherein the first conductive loop is wound in a clockwise direction and the third conductive loop in a counter-clockwise direction.

7. The integrated circuit package of claim 1, wherein the first conductive loop has a first end and a second end, wherein a first voltage is induced between the first and second ends of the first conductive loop in response to an external magnetic field that passes through the integrated circuit package, and the second conductive loop having a third end and a fourth end, wherein a second voltage is induced between the third and fourth ends in response to the external magnetic field that passes through the integrated circuit package, wherein the first conductive loop is coupled to the second conductive loop such that the first voltage between the first and second ends is substantially canceled by the second voltage between the third and fourth ends.

8. The integrated circuit package of claim 1, further comprising a first bond wire disposed within the package and coupled to the first conductive loop.

9. The integrated circuit package of claim 8, further comprising a second bond wire disposed within the package and coupled to the second conductive loop.

10. The integrated circuit package of claim 9, further comprising a third bond wire disposed within the package and coupled to the third conductive loop.

11. The integrated circuit package of claim 1, wherein the first and second conductive loops are disposed substantially in a same plane.

12. The integrated circuit package of claim 1, wherein the first, second, and third conductive loops each consist of one turn.

13. The integrated circuit package of claim 1, wherein the encapsulation is a molded insulating material.

14. The integrated circuit package of claim 1, wherein the receive circuit is included in a first integrated circuit die disposed within the encapsulation, wherein the first integrated circuit die is mounted on the first conductor of the lead frame.

15. The integrated circuit package of claim 14, wherein the transmit circuit is included in a second integrated circuit die disposed within the encapsulation, wherein the second integrated circuit die is mounted on the second conductor of the lead frame.

16. The integrated circuit package of claim 1, wherein the first and third conductive loops are disposed such that magnetically coupled signals induced in first and third conductive loops due to a changing magnetic field generated by current flow in the second conductive loop are additive.

17. The integrated circuit package of claim 1, wherein the first and third conductive loops are substantially the same size.