METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD AND REAR VIEW DEVICE
First Claim
1. A method of manufacturing a printed circuit board, comprising:
- manufacturing a plurality of plastic substrate parts in an injection molding process to form one or more first substrate parts each comprising at least one coupling means and one or more second substrate parts each comprising at least one receiving means to receive the coupling means;
selecting and connecting at least two of the substrate parts through the at least one coupling means and the at least one receiving means; and
providing the connected substrate parts with a circuit.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.
4 Citations
51 Claims
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1. A method of manufacturing a printed circuit board, comprising:
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manufacturing a plurality of plastic substrate parts in an injection molding process to form one or more first substrate parts each comprising at least one coupling means and one or more second substrate parts each comprising at least one receiving means to receive the coupling means; selecting and connecting at least two of the substrate parts through the at least one coupling means and the at least one receiving means; and providing the connected substrate parts with a circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A printed circuit board, comprising:
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a plurality of plastic substrate parts comprising one or more first substrate parts each comprising at least one coupling means; and one or more second substrate parts each comprising at least one receiving means to receive the coupling means, wherein at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means, and the connected substrate parts comprise a circuit. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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Specification