PHOTOELECTRIC SENSOR

• US 20180080817A1
• Filed: 01/18/2016
• Published: 03/22/2018
• Est. Priority Date: 03/31/2015
• Status: Active Grant

• Current Assignee: Panasonic Industrial Devices SUNX Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Industrial Devices SUNX Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: ICHIKAWA, Hiroki, OCHIAI, Takayuki
• Granted Patent: US 10,641,652 B2
• Time in Patent Office: Days
• CPC Class Codes: G01J 1/0411 using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• CPC Class Codes: G01J 1/42 using electric radiation detectors optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10
• CPC Class Codes: G01V 8/12 using one transmitter and one receiver
• CPC Class Codes: H01H 35/00 Switches operated by change of a physical condition operated by change of magnetic or electric field H01H36/00; thermally-actuated switches H01H37/00
• CPC Class Codes: H01L 31/02 Details

Abstract

In a case made of resin and provided with a condensing lens through which light is transmitted, a circuit board on which a photoelectric element to be disposed at the focus position of the condensing lens is accommodated. The circuit board has a through hole through which the light having been transmitted through the condensing lens passes. Furthermore, the photoelectric element is mounted on the back face of the circuit board on the opposite side of the condensing lens and receives the light having passed through the through hole.

Claims

1. A photoelectric sensor comprising:

a case made of resin and provided with a condensing lens through which light is transmitted;

a circuit board on which a photoelectric element disposed at a focus position of the condensing lens is mounted and which is accommodated in the case; and

a plate member made of metal and insert-molded in the case so as to be parallel with the circuit board,

wherein the circuit board has a through hole through which the light transmitted through the condensing lens passes,

wherein the photoelectric element is mounted on a face of the circuit board on an opposite side of the condensing lens, and the photoelectric element receives the light passed through the through hole; and

wherein the plate member is disposed on an opposite side of the condensing lens with respect to the circuit board, and the plate member has a cutout section passing through the plate member at a position overlapping with the photoelectric element in a thickness direction of the circuit board.

2. The photoelectric sensor according to claim 1, wherein the plate member includes a folded section folded to an inside of the case and embedded in the resin constituting the case, and

wherein the folded section includes a contact face which directs to a base end side of the folded section and which is in contact with the resin constituting the case.

3. The photoelectric sensor according to claim 2, wherein the plate member includes a flat plate section having a flat plate shape and provided so as to be parallel with the circuit board, and

wherein the folded section is formed by folding a peripheral section of the plate member so as to have an angle of 90°

or more with respect to the flat plate section on the inner side of the case.

4. The photoelectric sensor according to claim 3, wherein the folded section is formed so as to have an angle of 90°

with respect to the flat plate section on the inner side of the case, and the folded section has a cutout hole passing through the folded section, and

wherein the contact face is provided on an inner peripheral face of the cutout hole.

5. The photoelectric sensor according to claim 1, wherein a cable drawn out from the case to an outside is connected to the circuit board,

wherein the plate member includes a cable neighborhood folded section folded to the inner side of the case at a portion overlapping with the cable in the thickness direction of the circuit board, and

wherein the cable neighborhood folded section includes a cable neighborhood contact face which directs to a base end side of the cable neighborhood folded section and which is in contact with the resin constituting the case.

6. The photoelectric sensor according to claim 1,

wherein the case includes:

a case body made of resin in which the circuit board is accommodated and the plate member is insert-molded;

a cover made of resin which is disposed so as to cover the case body and in which the condensing lens is provided; and

a joint section made of resin which is formed by two-color molding between the case body and the cover so as to integrate the case body and the cover,

wherein a cable drawn out from the joint section to an outside of the case is connected to the circuit board,

wherein the joint section includes a first engaging section that receives a force applied from the case body in a drawing-out direction of the cable; and

wherein the case body includes a second engaging section engaging with the first engaging section in the drawing-out direction of the cable.

7. The photoelectric sensor according to claim 6, wherein the cover includes a cover-side engaging section engaging with the joint section so as to be relatively unmovable in the thickness direction of the circuit board on a side of the condensing lens further than the circuit board.

8. The photoelectric sensor according to claim 6, wherein the case body includes a bottom section on which the circuit board is disposed, and the case body includes a side wall section standing upright on a peripheral section of the bottom section,

wherein an indication lamp from which light is emitted is disposed on the circuit board, and

wherein the cover has light transmissivity so as to allow the light of the indication lamp to be transmitted, and the cover includes an extension section extending to a side of the bottom section further than a face of the circuit board on the opposite side of the condensing lens at an outer periphery of the circuit board and an extension section-side engaging section engaging with the joint section on the side of the bottom section further than the circuit board so as to be relatively unmovable in the thickness direction of the circuit board or in the direction parallel with the circuit board.