DISPLAY DEVICES AND METHODS FOR FORMING THE SAME

• US 20180122786A1
• Filed: 07/06/2017
• Published: 05/03/2018
• Est. Priority Date: 11/01/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: WU, Yuan-Lin, WU, Yu-Hsien, LEE, Kuan-Feng, TSAI, Tsung-Han
• Granted Patent: US 10,593,657 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/29499 Shape or distribution of the fillers
• CPC Class Codes: H01L 2224/32148 the layer connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 25/075 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1426 Driver
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A display device is provided. The display device includes a supporting film and a flexible substrate disposed on the supporting film. The display device also includes a driving layer disposed on the flexible substrate, and a conductive pad disposed on the driving layer. The display device further includes a light-emitting diode disposed on the conductive pad and electrically connected to the conductive pad, wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.

Claims

1. A display device, comprising:

a supporting film;

a flexible substrate disposed on the supporting film;

a driving layer disposed on the flexible substrate;

a conductive pad disposed on the driving layer; and

a light-emitting diode disposed on the conductive pad and electrically connected to the conductive pad,

wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.

2. The display device as claimed in claim 1, wherein the first hardness is between level 3B and level 3H of pencil hardness.

3. The display device as claimed in claim 1, wherein the supporting film is made of an insulating material.

4. The display device as claimed in claim 1, wherein the supporting film and the flexible substrate are made of different polymer materials, and the flexible substrate is more heat-resistant than the supporting film.

5. The display device as claimed in claim 1, wherein the supporting film has a first thickness, the light-emitting diode has a second thickness, and the first thickness is greater than the second thickness.

6. The display device as claimed in claim 5, wherein the flexible substrate has a third thickness, and the third thickness is less than the first thickness.

7. The display device as claimed in claim 5, further comprising:

a supporting glue disposed between the flexible substrate and the supporting film, wherein the supporting glue has a fourth thickness, and the fourth thickness is less than the first thickness.

8. The display device as claimed in claim 5, further comprising:

a conductive element disposed between the light-emitting diode and the conductive pad,

wherein the conductive pad has a fifth thickness, the conductive element has a sixth thickness, and the fifth thickness is less than the sixth thickness.

9. The display device as claimed in claim 8, wherein the conductive element comprises an anisotropic conductive film with a plurality of conductive particles, and the conductive particles have a height-width ratio in a range from 35% to 65%.

10. The display device as claimed in claim 8, wherein in a cross-sectional view, the conductive element has a first side adjacent to the conductive pad, and at least a portion of the first side is in a shape of curve.

11. The display device as claimed in claim 10, wherein in the cross-sectional view, the conductive pad has a second side adjacent to the driving layer, and at least a portion of the second side is in a shape of curve.

12. The display device as claimed in claim 11, wherein the curved portion of the first side and the curved portion of the second side are conformal.

13. A method for forming a display device, comprising:

forming a flexible substrate on a carrier substrate;

forming a driving layer on the flexible substrate;

forming a conductive pad on the driving layer;

performing a bonding process to bond a light-emitting diode to the conductive pad, wherein the light-emitting diode is electrically connected to the conductive pad;

removing the carrier substrate; and

attaching a supporting film to the flexible substrate,

wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.

14. The method as claimed in claim 13, wherein the first hardness is between level 3B and level 3H of pencil hardness.

15. The method as claimed in claim 13, wherein the supporting film has a first thickness, the light-emitting diode has a second thickness, and the first thickness is greater than the second thickness.

16. The method as claimed in claim 15, wherein the flexible substrate has a third thickness, and the third thickness is less than the first thickness.

17. The method as claimed in claim 15, further comprising:

forming a conductive element on the conductive pad or on the light-emitting diode before performing the bonding process,

wherein after performing the bonding process, the light-emitting diode is electrically connected to the conductive pad through the conductive element, the conductive pad has a fourth thickness and the conductive element has a fifth thickness, and the fourth thickness is less than the fifth thickness.

18. The method as claimed in claim 17, wherein the conductive element comprises an anisotropic conductive film with a plurality of conductive particles.

19. The method as claimed in claim 17, wherein in a cross-sectional view after performing the bonding process, the conductive element has a first side adjacent to the conductive pad, and at least a portion of the first side is in a shape of curve.

20. The method as claimed in claim 19, wherein in the cross-sectional view after performing the bonding process, the conductive pad has a second side adjacent to the driving layer, at least a portion of the second side is in a shape of curve, and the curved portion of the first side and the curved portion of the second side are conformal.