PREPARATION OF HIGH CONDUCTIVITY COPPER FILMS

  • US 20180134909A1
  • Filed: 02/02/2016
  • Published: 05/17/2018
  • Est. Priority Date: 06/11/2015
  • Status: Active Grant
First Claim
Patent Images

1. A copper precursor composition comprising:

  • a first copper complex comprising an imine or a first cyclic amine coordinated to a first copper precursor compound; and

    ,a second copper complex comprising a primary amine or a second cyclic amine coordinated to a second copper precursor compound,the copper precursor composition thermally degradable at a temperature lower than a comparable composition comprising only the second copper complex under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 μ

    Ω

    ·

    cm or less.

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