ELECTRONIC DEVICE PACKAGE
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.
29 Citations
45 Claims
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1-25. -25. (canceled)
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26. An electronic device package comprising:
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a package substrate including a substrate body having a top surface and a bottom surface; first connection terminals disposed on the substrate body and dedicated to electrically connect the electronic device package to an external device; second connection terminals disposed on the top surface of the substrate body; an interposer disposed on the top surface of the substrate body of the package substrate and electrically connected to the package substrate by the second connection terminals, the interposer including an interposer body and through-vias extending vertically through the interposer body; a processor disposed above the interposer and electrically connected to the through-vias of the interposer; at least one high bandwidth memory disposed above the interposer and electrically connected to the processor by the interposer; a power management integrated circuit electrically connected to the processor; and a passive electronic component disposed on or within the interposer body of the interposer and electrically connected to the power management integrated circuit.
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27. An electronic device package comprising:
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a package substrate including a substrate body, and connection terminals disposed on a top surface of the substrate body; a processor; at least one high bandwidth memory; a power management integrated circuit; an intermediate structure including at least one interposer interposed between the package substrate and both the processor and the at least one high bandwidth memory and to which the processor and the at least one high bandwidth memory are mounted, each said at least one interposer including an interposer body and through-vias extending vertically through the interposer body and electrically connected to the connection terminals of the package substrate; and a passive electronic component, and wherein the processor is disposed on the intermediate structure and is electrically connected to the through-vias of the at least one interposer of the intermediate structure so as to be electrically connected to the connection terminals of the package substrate by the at least one interposer, the at least one high bandwidth memory is disposed on the intermediate structure beside the processor and is electrically connected to the processor by the intermediate structure, the passive electronic component is disposed on or within the interposer body of a said interposer of the intermediate structure and is electrically connected to the power management integrated circuit, and the power management integrated circuit is electrically connected to the processor by the intermediate structure. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification