Three-Layer Package-on-Package Structure and Method Forming Same
First Claim
1. A package comprising:
- a first plurality of redistribution lines;
a first encapsulating material underlying the first plurality of redistribution lines;
a first metal post penetrating through the first encapsulating material, wherein the first metal post is electrically coupled to the first plurality of redistribution lines;
a first device die encapsulated in the first encapsulating material, wherein the first device die is bonded to the first plurality of redistribution lines through flip-chip bonding;
a second device die underlying and attached to the first encapsulating material through an adhesive film;
a second encapsulating material encapsulating the second device die therein;
a second metal post penetrating through the second encapsulating material and electrically connecting to the first metal post; and
a second plurality of redistribution lines underlying and electrically coupling to the second device die and the second metal post.
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Abstract
A method includes forming a first plurality of redistribution lines, forming a first metal post over and electrically connected to the first plurality of redistribution lines, and bonding a first device die to the first plurality of redistribution lines. The first metal post and the first device die are encapsulated in a first encapsulating material. The first encapsulating material is then planarized. The method further includes forming a second metal post over and electrically connected to the first metal post, attaching a second device die to the first encapsulating material through an adhesive film, encapsulating the second metal post and the second device die in a second encapsulating material, planarizing the second encapsulating material, and forming a second plurality of redistributions over and electrically coupling to the second metal post and the second device die.
7 Citations
20 Claims
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1. A package comprising:
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a first plurality of redistribution lines; a first encapsulating material underlying the first plurality of redistribution lines; a first metal post penetrating through the first encapsulating material, wherein the first metal post is electrically coupled to the first plurality of redistribution lines; a first device die encapsulated in the first encapsulating material, wherein the first device die is bonded to the first plurality of redistribution lines through flip-chip bonding; a second device die underlying and attached to the first encapsulating material through an adhesive film; a second encapsulating material encapsulating the second device die therein; a second metal post penetrating through the second encapsulating material and electrically connecting to the first metal post; and a second plurality of redistribution lines underlying and electrically coupling to the second device die and the second metal post. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A package comprising:
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a first encapsulating material; a first device die in the first encapsulating material; a first through-via penetrating through the first encapsulating material; a second encapsulating material over and in contact with the first encapsulating material; a second device die in the second encapsulating material; a second through-via penetrating through the second encapsulating material, wherein the second through-via contacts the first through-via; a first plurality of redistribution lines and a second plurality of redistribution lines on opposite sides of a combined structure comprising both the first encapsulating material and the second encapsulating material; and a package bonded to the second plurality of redistribution lines through solder bonding. - View Dependent Claims (14, 15, 16)
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17. A package comprising:
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a first plurality of redistribution lines; a first encapsulating material over the first plurality of redistribution lines; a first device die in the first encapsulating material, wherein the first device die comprises first conductive features contacting the first plurality of redistribution lines; a second encapsulating material over and in contact with the first encapsulating material; a second device die in the second encapsulating material, wherein the second device die comprises second conductive features, wherein a portion of the second device die is separated from the first encapsulating material by a portion of the second encapsulating material; and a second plurality of redistribution lines over the second encapsulating material. - View Dependent Claims (18, 19, 20)
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Specification