DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

• US 20180233542A1
• Filed: 04/09/2018
• Published: 08/16/2018
• Est. Priority Date: 12/11/2015
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: CHOI, Su Hyuk, PARK, Jin Woo, KIM, Ho Youn, OH, Hyun Chul, LEE, Ung Soo, LEE, Jun Young, JUNG, Hyun Soo
• Granted Patent: US 10,312,301 B2
• Time in Patent Office: Days
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a touch sensor layer including sensing electrodes arranged in the third area and sensing lines connected between the sensing electrodes and the sensing pads, an interlayer arranged between the thin film encapsulation layer and the touch sensor layer, and a conductive member connected between the connecting pads and the sensing pads.

Claims

1. A manufacturing method of a display device, the manufacturing method comprising:

preparing a first substrate on which light emitting elements, a thin film encapsulation layer and connecting pads are formed;

preparing a second substrate on which a touch sensor layer including sensing electrodes and sensing lines and sensing pads electrically connected to the sensing electrodes through the sensing lines are formed;

applying an interlayer to the thin film encapsulation layer or the touch sensor layer;

applying a conductive member to the connecting pads or the sensing pads;

reversing the second substrate such that the touch sensor layer faces the thin film encapsulation layer; and

bonding the first substrate to the second substrate through the interlayer.

2. The manufacturing method of claim 1, wherein the applying of the interlayer comprises using one of a printing method, a coating method and a dispensing method.

3. The manufacturing method of claim 1, wherein the first substrate and the second substrate are flexible substrates,

the preparing of the first substrate comprises using a third substrate having rigidity as a carrier substrate of the first substrate, and

the preparing of the second substrate comprises using a fourth substrate having rigidity as a carrier substrate of the second substrate.

4. The manufacturing method of claim 3, further comprising removing the third substrate and the fourth substrate.

5. The manufacturing method of claim 1, wherein the interlayer has adhesiveness.

6. The manufacturing method of claim 1, wherein the bonding of the first substrate to the second substrate comprises electrically connecting the connecting pads to the sensing pads through the conductive member.

7. The manufacturing method of claim 1, wherein the sensing electrodes include sensing cells, connecting patterns interconnecting the sensing cells and auxiliary cells arranged on a layer different from that of the sensing cells and electrically connected to the sensing cells.

8. The manufacturing method of claim 7, wherein the sensing lines include first conductive lines and second conductive lines arranged on a layer different from that of the first conductive lines and electrically connected to the first conductive lines.

9. The manufacturing method of claim 8, wherein the preparing of the second substrate comprises further forming an insulating layer arranged between the sensing cells and the auxiliary cells and between the first conductive lines and the second conductive lines.

10. The manufacturing method of claim 9, wherein the sensing pads include first conductive patterns and second conductive patterns contacting the first conductive patterns.

11. The manufacturing method of claim 10, wherein the first conductive lines are directly connected to the first conductive patterns.

12. The manufacturing method of claim 11, wherein the second conductive lines are directly connected to the second conductive patterns.

13. The manufacturing method of claim 11, wherein the second conductive lines are spaced apart from the second conductive patterns by a predetermined distance, and electrically connected to the first conductive patterns through the first conductive lines.

14. The manufacturing method of claim 13, wherein a distance between the second conductive lines and the second conductive patterns is set to 10 um to 1000 um.

15. The manufacturing method of claim 7, wherein the sensing cells and the auxiliary cells include a mesh shape including a plurality of openings.

16. The manufacturing method of claim 15, wherein the connecting patterns include the mesh shape including the plurality of openings.

17. The manufacturing method of claim 1, wherein the thin film encapsulation layer includes at least one organic layer and at least one inorganic layer.

18. The manufacturing method of claim 1, wherein the conductive member includes a conductive ball.

19. The manufacturing method of claim 13, wherein the applying of the conductive member comprises using a dispensing method.