METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS

• US 20180277504A1
• Filed: 05/25/2018
• Published: 09/27/2018
• Est. Priority Date: 06/08/2011
• Status: Active Application

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher
• Granted Patent: US 10,262,966 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/11002 for supporting the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13013 being rectangular or square
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29026 : relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/75312 : Material
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/7698 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/8114 : Guiding structures outside the body
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81395 : having an external coating, e.g. protective bond-through coating
• CPC Class Codes: H01L 2224/81411 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81901 : Pressing the bump connector against the bonding areas by means of another connector detachable pressure contact H01L2224/72
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 : Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/04 : the devices not having separate containers
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1205 : Capacitor
• CPC Class Codes: H01L 2924/1304 : Transistor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: Y10T 156/1039 : Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts,

Claims

1. (canceled)

2. A method of making a wafer having transfer-printable active components disposed therein or thereon, comprising:

providing a wafer;

disposing active components in or on the wafer, the active components each comprising a circuit structure having a post surface and an opposing stamp surface, the circuit structure comprising an electronic circuit;

disposing a plurality of electrically conductive connection posts on each of the active components, the plurality of connection posts protruding from the post surface, wherein the plurality of connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and

disposing a breakable component tether releasably attaching the circuit structure to the wafer.

3. The method of claim 2, comprising providing a destination substrate comprising a receiving surface and electrical contacts disposed on the receiving surface and transfer printing one or more of the active components from the wafer to the receiving surface of the destination substrate so that each of the conductive connection posts protruding from the post surface of the one or more of the active components is electrically connected to an electrical contact of the electrical contacts.

4. The method of claim 3, comprising transfer printing one or more of the active components from the wafer to the receiving surface of the destination substrate using a stamp so that each of the conductive connection posts protruding from the post surface of the one or more of the active components is electrically connected to an electrical contact of the electrical contacts.

5. The method of claim 3, comprising disposing an adhesive layer on the receiving surface of the destination substrate to adhere the one or more active components to the destination substrate.

6. The method of claim 2, comprising building up a three-dimensional structure to form each of the plurality of connection posts.

7. An active component, comprising:

a circuit structure comprising an electronic circuit and connection pads, each of the connection pads electrically connected to the electronic circuit;

an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and

a fractured component tether physically connected to the circuit structure.

8. The active component of claim 7, wherein the connection pads are each a planar electrical connection formed on a surface of the circuit structure.

9. The active component of claim 7, wherein the connection post protruding from each of the connection pads has a peak that is a sharp point.

10. The active component of claim 7, wherein the connection post protruding from each of the connection pads has one or more of a height that is greater than its base width, a base width that is greater than its peak width, and a base area that is greater than its peak area.

11. The active component of claim 7, wherein the electronic circuit is one or more of an integrated circuit, a transistor, a capacitor, and a light-emitting diode.

12. The active component of claim 7, wherein a surface of the electronic circuit has a dimension from 5 microns to 5000 microns.

13. A wafer comprising:

an electronic circuit;

connection pads electrically connected to the electronic circuit;

an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and

a breakable component tether releasably attaching the electronic circuit to the wafer.

14. The wafer of claim 13, wherein the connection post protruding from each of the connection pads has one or more of a height that is greater than its base width, a base width that is greater than its peak width, and a base area that is greater than its peak area.

15. The wafer of claim 13, wherein a surface of the electronic circuit has a dimension from 5 microns to 5000 microns.

16. A method of making a wafer having transfer-printable active components disposed thereon or therein, comprising:

providing a wafer;

disposing an electronic circuit in or on the wafer;

disposing connection pads in or on the wafer, each of the connection pads electrically connected to the electronic circuit;

disposing an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and

disposing a breakable component tether releasably attaching the electronic structure to the wafer.

17. The method of claim 16, comprising:

providing a destination substrate having a receiving surface; and

transfer printing the electronic circuit from the wafer to the receiving surface of the destination substrate.

18. The method of claim 17, comprising coating an adhesive layer on the receiving surface in order to adhere the transfer printed electronic circuit to the destination substrate.

19. The method of claim 17, comprising building up a three-dimensional structure to form the connection post protruding from each of the connection pads.

20. A printed structure comprising:

a destination substrate comprising electrical contacts;

a circuit structure comprising an electronic circuit, connection pads, and a broken tether, wherein each of the connection pads is electrically connected to the electronic circuit; and

an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit,

wherein the connection post is in electrical contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contact to the connection post.

21. The printed structure of claim 20, wherein the electrical contacts of the destination substrate have a composition softer than that of the connection posts.

22. The printed structure of claim 20, wherein the connection post adheres to the electrical contact of the destination substrate.