THERMOELECTRIC COOLER (TEC) FOR SPOT COOLING OF 2.5D/3D IC PACKAGES

• US 20190074237A1
• Filed: 09/06/2017
• Published: 03/07/2019
• Est. Priority Date: 09/06/2017
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google LLC (Alphabet Inc.)
• Inventors: Beauchemin, Melanie, Iyengar, Madhusudan, Malone, Christopher, Imwalle, Gregory
• Granted Patent: US 10,504,816 B2
• Time in Patent Office: Days
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/023 Mounting details thereof
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1434 Memory

Abstract

While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Claims

1. An integrated component package comprising:

a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component;

a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and

a plurality of thermoelectric cooling (TEC) elements, wherein the TEC elements are sized and positioned within the integrated component package such that at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the surface of the substrate to which the lower-power components and the high-power component are coupled to overlap with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the surface of the substrate to which the lower-power components and the high-power component are coupled to substantially overlap the high-power component.

2. The package of claim 1, wherein the TECs are integrated into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid.

3. The package of claim 2, wherein the base surface of the cold plate includes a plurality of insulating notches, each notch positioned adjacent to one of the plurality of TECs.

4. The package of claim 1, wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate.

5. The package of claim 1, wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components.

6. The package of claim 1, wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components.

7. The package of claim 1, wherein a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.

8. The package of claim 1, wherein each TEC is independently powered.

9. A method of assembling an integrated component package, the method comprising:

coupling a plurality of lower-power components and a high-power component to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

coupling a package lid to the package substrate, wherein the package lid covers the plurality of lower-power components and the high-power component;

physically and thermally coupling a cold plate to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and

sizing and positioning a plurality of thermoelectric cooling (TEC) elements within the integrated component package such that at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the surface of the substrate to which the lower-power components and the high-power component are coupled to overlap with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the surface of the substrate to which the lower-power components and the high-power component are coupled to substantially overlap the high-power component.

10. The method of claim 10 further comprising integrating the TECs into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid.

12. The method of claim 10, further comprising integrating the TECs into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate.

13. The method of claim 10, further comprising integrating the TECs into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components.

14. The method of claim 10, further comprising integrating the TECs into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components.

15. The method of claim 10, further comprising integrating the TECs into the package lid such that a first side of each TEC is coupled, and thermally coupled to the and a second side of each TEC is physically and thermally coupled to the low power components.

16. The method of claim 10, further comprising integrating the TECs into the package lid such that a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.

17. The method of claim 10, further comprising independently powering each TEC.

11. The method of claim 11 further comprising including a plurality of insulating notches in the base surface of the cold plate such that each notch is positioned adjacent to one of the plurality of TECs.

18. A method comprising:

controlling a temperature during normal operation in an integrated component package that includes a package lid covering a plurality of lower-power components located adjacent to a high-power component and the high-power component generates a higher amount of heat relative to each of the lower-power components during normal operation by;

providing site specific cooling of the package lid at localized regions of greater heat sensitivity, wherein the localized regions of greater heat sensitivity are adjacent the lower-power components and a localized region of lower heat sensitivity is adjacent the high-temperature component; and

providing cold plate cooling of the package lid.

19. The method of claim 19, wherein site specific cooling of the package lid at the localized regions of greater heat sensitivity includes active cooling and cooling of the package lid at the localized region of lower heat sensitivity includes passive cooling.

20. The method of claim 20, wherein:

site-specific active cooling of the package lid is provided by a plurality of TECs, and

the plurality of thermoelectric cooling (TEC) elements are sized and positioned within the integrated component package such that at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to a surface of a substrate to which the lower-power components and the high-power component are coupled to overlap with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the surface of the substrate to which the lower-power components and the high-power component are coupled to substantially overlap the high-power component.

21. The method of claim 20, wherein the TECs are integrated into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid.

22. The method of claim 21, wherein the base surface of the cold plate includes a plurality of insulating notches, each notch positioned adjacent to one of the plurality of TECs.

23. The method of claim 21, wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate.

24. The method of claim 21, wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components.

25. The method of claim 21, wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components.

26. The method of claim 21, wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the and a second side of each TEC is physically and thermally coupled to the low power components.

27. The method of claim 21, wherein a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.

28. The method of claim 21, wherein each TEC is independently powered.