IMD HAVING A CORE CIRCUITRY SUPPORT STRUCTURE

• US 20190215978A1
• Filed: 03/18/2019
• Published: 07/11/2019
• Est. Priority Date: 04/18/2016
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Bobgan, Jean M., Stieper, David P., Prescott, Joseph
• Granted Patent: US 10,542,633 B2
• Time in Patent Office: Days
• CPC Class Codes: A61B 2562/0219 Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
• CPC Class Codes: A61B 2562/0233 Special features of optical sensors or probes classified in A61B5/00
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/0271 Thermal or temperature sensors
• CPC Class Codes: A61B 2562/08 Sensors provided with means for identification, e.g. barcodes or memory chips
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/162 Capsule shaped sensor housings, e.g. for swallowing or implantation
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/021 Measuring pressure in heart or blood vessels A61B5/0205 takes precedence
• CPC Class Codes: A61B 5/1118 Determining activity level
• CPC Class Codes: A61B 5/14542 for measuring blood gases A61B5/14551 takes precedence
• CPC Class Codes: A61B 5/29 for permanent or long-term implantation
• CPC Class Codes: A61B 5/6847 mounted on an invasive device
• CPC Class Codes: A61B 5/686 Permanently implanted devices, e.g. pacemakers, other stimulators, biochips A61B5/6861 takes precedence
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 7/1427 Housings

Abstract

A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.

Claims

1. A medical device comprising:

a hybrid circuitry assembly comprising a printed circuit board (PCB) having a first surface and a second, parallel surface; and

a core circuitry support structure, comprising;

a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly,

wherein an outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.

2. The medical device of claim 1, the frame comprising:

a first end wall;

a second, opposite end wall; and

a pair of parallel, opposed side walls, wherein the first end wall, second end wall, and side walls define the cavity.

3. The medical device of claim 2, the frame comprising at least one alignment feature, the at least one alignment feature configured to facilitate alignment of the hybrid circuitry assembly with the core circuitry support structure.

4. The medical device of claim 3, the PCB comprising at least one alignment notch, wherein the at least one alignment notch is configured to receive the at least one alignment feature.

5. The medical device of claim 4, the at least one alignment feature comprising:

a first alignment feature having a first shape and a first size; and

a second alignment feature having a second shape and a second size, wherein;

the second shape is different than the first shape, and/or

the second size is different than the first size.

6. The medical device of claim 1, the core circuitry support structure comprising a shelf extending at least partially around a perimeter of the core circuitry support structure, wherein the shelf is configured to engage a peripheral edge of the first surface of the PCB.

7. The medical device of claim 2, the hybrid circuitry assembly further comprising:

a first set of additional circuitry components coupled to the first side of the PCB; and

a second set of additional circuitry components coupled to the second side of the PCB.

8. The medical device of claim 7, wherein the core circuitry support structure comprises a panel coupled to the first end wall, second end wall and side walls, wherein the first end wall, second end wall, and side walls define the cavity.

9. The medical device of claim 7, further comprising a cover configured to be disposed over the second set of additional circuitry components, the cover comprising an outer surface shaped to correspond to the inner surface of the core assembly housing.

10. The medical device of claim 2, the panel comprising a recess defined in an outside surface of the panel, the recess configured to receive an X-ray identification tag.

11. A medical device comprising:

a header having a first end and a second end;

a feed-through assembly coupled to the second end of the header; and

a core assembly coupled, at a first end, to the feed-through assembly, the core assembly comprising;

a core assembly housing enclosing an interior space;

a core circuitry assembly disposed in the interior space, the core circuitry assembly comprising;

a hybrid circuitry assembly; and

a core circuitry support structure, the core circuitry support structure comprising a frame defining a cavity that is configured to receive at least a portion of the hybrid circuitry assembly.

12. The medical device of claim 11, the hybrid circuitry assembly comprising a printed circuit board (PCB) having a first surface and a second, parallel surface, wherein the core circuitry support structure includes at least one alignment feature, the at least one alignment feature configured to facilitate alignment of the hybrid circuitry assembly with the core circuitry support structure.

13. The medical device of claim 12, the PCB comprising at least one alignment notch, wherein the at least one alignment notch is configured to receive the at least one alignment feature.

14. The medical device of claim 12, the at least one alignment feature comprising:

a first alignment feature having a first shape and a first size; and

a second alignment feature having a second shape and a second size, wherein;

the second shape is different than the first shape and/or

the second size is different than the first size.

15. The medical device of claim 12, the core circuitry support structure comprising a shelf extending at least partially around a perimeter of the core circuitry support structure, wherein the shelf is configured to engage a peripheral edge of the first surface of the PCB.

16. The medical device of claim 12, the hybrid circuitry assembly further comprising:

a first set of additional circuitry components coupled to the first side of the PCB; and

a second set of additional circuitry components coupled to the second side of the PCB.

17. The medical device of claim 16, the frame comprising:

a first end wall;

a second, opposite end wall; and

a pair of parallel, opposed side walls, wherein the first end wall, second end wall, and side walls define the cavity.

18. The medical device of claim 16, further comprising a cover configured to be disposed over the second set of additional circuitry components, the cover comprising an outer surface shaped to correspond to the inner surface of the core assembly housing.

19. The medical device of claim 17, the panel comprising a recess defined in an outside surface of the panel, the recess configured to receive an X-ray identification tag.

20. A method of manufacturing a medical device, comprising:

providing a hybrid circuitry assembly;

forming a core circuitry support structure, the core circuitry support structure comprising an alignment feature configured to facilitate alignment of the hybrid circuitry assembly with the core circuitry support structure;

coupling the hybrid circuitry assembly to the core circuitry support structure to form a core circuitry assembly;

positioning a first portion and a second portion of a core assembly housing around the core circuitry assembly; and

welding the first and second portions together.