ELECTRONIC DEVICE MODULE

• US 20190311994A1
• Filed: 11/06/2018
• Published: 10/10/2019
• Est. Priority Date: 04/05/2018
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: HONG, Suk Youn, KIM, Jang Hyun, KIM, Hye Kyung, HONG, Seung Hyun, RYU, Jong In
• Granted Patent: US 10,629,542 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/4814 Conductive parts
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/023 using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence

Abstract

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Claims

1. An electronic device module comprising:

a substrate;

at least one first component and at least one second component disposed on one surface of the substrate;

a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate; and

a sealing portion comprising the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate,

wherein the shielding wall comprises at least one insulating layer and at least one conductive layer disposed on the at least one insulating layer.

2. The electronic device module of claim 1, further comprising:

a shielding layer disposed on a surface of the sealing portion,

wherein the at least one conductive layer is electrically connected to the shielding layer.

3. The electronic device module of claim 2, wherein the substrate comprises a ground electrode disposed to be exposed to the outside of the sealing portion and electrically connected to the shielding layer.

4. The electronic device module of claim 2, further comprising a bonding layer of a conductive material disposed on a lower end surface of the shielding wall opposing the substrate and on an upper end surface of the shielding wall connected to the shielding layer.

5. The electronic device module of claim 1, further comprising:

a conductive adhesive agent disposed between the shielding wall and the substrate.

6. The electronic device module of claim 1, wherein the shielding wall further comprises:

an insulating film disposed between the at least one conductive layer and the sealing portion.

7. The electronic device module of claim 6, wherein the insulating film comprises an oxide film.

8. The electronic device module of claim 1, wherein the at least one conductive layer comprises conductive layers respectively disposed on opposing surfaces of the at least one insulating layer.

9. The electronic device module of claim 8, wherein the shielding wall comprises a plurality of interlayer connecting conductors penetrating through the at least one insulating layer and electrically connecting the conductive layers on the opposing surfaces.

10. The electronic device module of claim 9, wherein the interlayer connecting conductor comprises a first connecting conductor disposed in the at least one insulating layer and a second connecting conductor disposed on an edge of the at least one insulating layer.

11. The electronic device module of claim 10, wherein at least a portion of the second connecting conductor is disposed to be exposed to an upper end surface or a lower end surface of the shielding wall.

12. The electronic device module of claim 11, wherein the second connecting conductor is formed in smaller size than a size of the first connecting conductor.

13. The electronic device module of claim 1, wherein the substrate comprises a ground electrode disposed on a lower portion of the shielding wall and connected to the conductive layer.

14. The electronic device module of claim 1, wherein the layers of the shielding wall further comprise an external insulating layer disposed on an external surface of the at least one conductive layer.

15. An electronic device module, comprising:

a first circuit substrate including a ground electrode;

at least one first component and at least one second component disposed on one surface of the first circuit substrate;

a second circuit substrate disposed between the at least one first component and the at least one second component and disposed on the first circuit substrate to be substantially perpendicular to the first circuit substrate; and

a sealing portion having the at least one first component, the at least one second component and the second circuit substrate embedded therein, and disposed on the substrate,

wherein a wiring layer on the second circuit substrate is connected to the ground electrode on the first circuit substrate.

16. The electronic device module of claim 15, wherein the second circuit substrate further comprises an insulating layer, and a plurality of interlayer connecting conductors penetrating through the insulating layer,

wherein the wiring layer comprises two wiring layers disposed on opposing surfaces of the insulating layer, and the plurality of interlayer connecting conductors connect the two wiring layers to each other.

17. An electronic device module, comprising:

a first substrate comprising a first region and a second region on a surface;

a second substrate comprising a ground layer electrically connected to the first substrate, the second substrate disposed on the surface and extending from the surface to divide the surface into the first region and the second region.

18. The electronic device module of claim 17, wherein the first region and the second region are electromagnetically shielded from each other by the second substrate.

19. The electronic device module of claim 18, further comprising:

a first component disposed in the first region;

a second component disposed in the second region;

a first sealing portion embedding the first component;

a second sealing portion embedding the second component; and

a shielding layer disposed on the first and second sealing portions electrically connected to the ground layer,

wherein the second substrate is embedded in the first and second sealing portions.

20. The electronic device module of claim 17, wherein the second substrate further comprises an insulating layer;

interlayer conductors penetrating through the insulating layer; and

an insulating film,

wherein the ground layer comprises a first conductive layer on one surface of the insulating layer and a second conductive layer on an opposite surface of the insulating layer electrically connected to the first conductive layer by the interlayer conductors, and

wherein the insulating film is disposed on the first and second conductive layers.