DEVICE AND METHOD FOR CONTACTLESSLY TRANSFERRING AT LEAST PARTLY FERROMAGNETIC ELECTRONIC COMPONENTS FROM A CARRIER TO A SUBSTRATE

• US 20200027764A1
• Filed: 09/22/2017
• Published: 01/23/2020
• Est. Priority Date: 09/29/2016
• Status: Active Grant

• Current Assignee: Muehlbauer GmbH & Co. KG
• Original Assignee: Muehlbauer GmbH & Co. KG
• Inventors: Monser, Hans-Peter, Niklas, Sigmund
• Granted Patent: US 11,062,927 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/7525 Means for applying energy, e.g. heating means
• CPC Class Codes: H01L 2224/75261 Laser
• CPC Class Codes: H01L 2224/7555 Mechanical means, e.g. for planarising, pressing, stamping
• CPC Class Codes: H01L 2224/75701 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75704 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75705 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/83005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/8312 Aligning
• CPC Class Codes: H01L 2224/83143 Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/951 Supplying the plurality of semiconductor or solid-state bodies
• CPC Class Codes: H01L 2224/95144 : Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

Abstract

The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Claims

1. A device for transferring at least partly ferromagnetic electronic components from a dispensing carrier to a receiving substrate, wherein the device comprises:

a first holding fixture for the dispensing carrier which carrier is configured and arranged to hold at least partly ferromagnetic electronic components on the side of the carrier facing the substrate, and wherein the first holding fixture is located at a predetermined distance from

a second holding fixture for the receiving substrate, which is configured and arranged to receive one of the components at a place predetermined for this on the substrate,

a detachment unit, which is configured and arranged at least to support a detachment of one of the components in each case from the carrier in order to transfer it to the substrate,

a magnetic arrangement, which is to be positioned relative to the second holding fixture for the substrate so that a magnetic field produced by it exerts a magnetic attraction force directed from the carrier towards the substrate on the component, at least during the transfer of the component, wherein the attraction force at least supports a placement of the component onto the place predetermined for this on the substrate, characterized in that the detachment unit for detaching the components attached to the carrier from the carrier is a laser that is controllable in its intensity, and

a mirror arrangement of one or more movable mirrors and at least one mirror positioning actuator are provided, wherein the mirror positioning actuator is adapted to move and/or to swivel at least a single mirror of the mirror arrangement to reflect an emitted laser beam of the detachment unit.

2. The device according to claim 1, wherein the magnetic arrangement comprises one or more permanent magnets and/or electromagnets, and/or further comprising at least one magnet adjustment or positioning device, which is configured and arranged to move and/or to swivel at least one magnet of the magnetic arrangement.

3. The device according to claim 1, wherein the second holding fixture for the substrate is configured and arranged to move the substrate successively or continuously relative to the first holding fixture for the dispensing carrier, wherein the substrate has a plurality of predetermined places for receiving components.

4. The device according to claim 3, wherein the side of the substrate facing away from the component is guided by the second holding fixture over a support.

5. The device according to claim 3, wherein the magnetic arrangement is positioned at least partly in a receiving device of the support provided for this.

6. The device according to claim 1, further comprising a first actuator, which is configured and arranged to move and/or to swivel the first holding fixture, and/or further comprising a second actuator, which is configured and arranged to move and/or to swivel the second holding fixture.

7. The device according to claim 1, further comprising a first sensor, in particular an imaging sensor, which is configured and arranged to determine a position of the component on the carrier directly and/or by detection of a reference marking, and/or further comprising a second sensor, in particular an imaging sensor, which is configured and arranged to determine a position of the component on the substrate directly and/or by detection of a reference marking.

8. The device according to claim 7, further comprising at least one programmable control unit with a memory function, which is configured to evaluate and/or store the information of the first sensor, and/or to evaluate and/or store the information of the second sensor.

17. The device according to claim 6, further comprising at least one programmable control unit with a memory function, which is configured to control the first actuator, and/or to control the second actuator, and/or to control each mirror positioning actuator of the mirror arrangement according independently of one another in each case.

18. The device according to claim 1, further comprising at least one programmable control unit with a memory function, which is configured to control the intensity of the laser.

19. The device according to claim 2, further comprising at least one programmable control unit with a memory function, which is configured to control each magnet adjustment or positioning device independently of one another in each case, and/or to control a power supply for each electromagnet independently of one another in each case.

9. A method for transferring at least partly ferromagnetic electronic components from a dispensing carrier to a receiving substrate, wherein the method is characterized by:

provision of at least partly ferromagnetic electronic components on the side of the carrier facing the substrate,

positioning of the carrier by a first holding fixture at a predetermined distance from a second holding fixture for the substrate and in relation to a detachment unit for the components,

detachment of one of the components in each case from the carrier, at least supported by the detachment unit, in order to transfer the respective component from the carrier to a place predetermined for this on the substrate, wherein the detachment unit is a laser controllable in its intensity for detaching the components attached to the carrier from the carrier,

provision of a mirror arrangement of one or more movable mirrors and at least one mirror positioning actuator,

movement and/or swivelling of at least a single mirror of the mirror arrangement by means of the mirror positioning actuator to reflect an emitted laser beam of the detachment unit,

attraction of the at least partly ferromagnetic electronic component by a magnetic attraction force, which is exerted by a magnetic field on the component, wherein the magnetic field is produced by a magnetic arrangement, which is positioned relative to the substrate located in the second holding fixture so that the magnetic attraction force at least supports a placement of the component on the place predetermined for this on the substrate, and

receiving of the component at the place predetermined for this on the substrate, which is positioned by the second holding fixture.

10. The method according to claim 9, wherein the magnetic arrangement is formed from one or more magnets and/or electromagnets, and/or wherein at least one magnet of the magnetic arrangement is moved and/or swivelled by at least one magnet adjustment or positioning device.

11. The method according to claim 9, wherein the first holding fixture is moved and/or swivelled by a first actuator, and/or wherein the second holding fixture is moved and/or swivelled by a second actuator.

12. The method according to claim 9,

further comprising a first sensor, in particular an imaging sensor, which determines a position of the component on the carrier directly and/or by detection of a reference marking, and/or

further comprising a second sensor, in particular an imaging sensor, which determines a position of the component on the substrate directly and/or by detection of a reference marking.

13. The method according to claim 12. further comprising at least one programmable control unit with a memory function, which evaluates and/or stores the information of the first sensor, and/or evaluates and/or stores the information of the second sensor.

14. The method according to claim 11, further comprising at least one programmable control unit with a memory function, which controls the first actuator, and/or controls the second actuator, and/or controls each mirror positioning actuator independently of one another in each case.

15. The method according to claim 9, further comprising at least one programmable control unit with a memory function, which controls the intensity of the laser.

16. The method according to claim 10, further comprising at least one programmable control unit with a memory function, which controls each magnet adjustment or positioning device independently of one another in each case, and/or controls a power supply for each electromagnet independently of one another in each case.