ADHESIVE-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND WIRING SUBSTRATE

• US 20200029442A1
• Filed: 09/26/2019
• Published: 01/23/2020
• Est. Priority Date: 03/28/2017
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: UCHIDA, Kazumichi
• Granted Patent: US 10,660,213 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: C09J 11/06 organic
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 171/00 Adhesives based on polyethers obtained by reactions forming an ether link in the main chain based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06; Adhesives based on derivatives of such polymers
• CPC Class Codes: C09J 4/00 Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
• CPC Class Codes: C09J 7/20 characterised by their carriers
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/382 by special treatment of the metal
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane

Abstract

There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

Claims

1. An adhesive-attached copper foil comprising:

a copper foil having a roughened surface on one surface of the copper foil, the roughened surface having a silane coupling agent layer surface-treated by methacrylic silane, acrylic silane or isocyanurate silane; and

an adhesive layer formed on the roughened surface and made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

2. The adhesive-attached copper foil according to claim 1, wherein

the resin composition contains:

(A) modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound;

(B) a cyanurate compound containing at least one type of triallyl isocyanurate and triallyl cyanurate; and

(C) organic peroxide,

the modified polyphenylene ether (A) contains polyphenylene ether represented by the following general formula (I)

3. The adhesive-attached copper foil according to claim 2, wherein

the resin composition further contains a butadiene.styrene copolymer (D).

4. The adhesive-attached copper foil according to claim 1, wherein

a thickness of the copper foil is 5 to 70 μ

m, and

surface roughness Rz of the roughened surface is 2 to 20% of the thickness.

5. The adhesive-attached copper foil according to claim 4, wherein

the surface roughness Rz is 0.1 to 2.0 μ

m.

6. A copper-clad laminate comprising:

a copper foil having a roughened surface on one surface of the copper foil, the roughened surface having a silane coupling agent layer surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane; and

the prepreg laminated on the roughened surface and made by impregnating a glass cloth with a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

7. The copper-clad laminate according to claim 6, wherein

the resin composition contains:

(A) modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound;

(B) a cyanurate compound containing at least one type of triallyl isocyanurate and triallyl cyanurate; and

(C) organic peroxide,

the modified polyphenylene ether (A) contains polyphenylene ether represented by the following general formula (I)

8. A wiring substrate comprising the copper-clad laminate according to claim 6, the copper foil processed into a wiring pattern.

9. A copper-clad laminate comprising:

a copper foil having a roughened surface on one surface of the copper foil, the roughened surface having a silane coupling agent layer surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane;

an adhesive layer formed on the roughened surface and made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound; and

a prepreg laminated on the adhesive layer and made by impregnating a glass cloth with a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.