CHIP-ON-BOARD MODULAR LIGHTING SYSTEM AND METHOD OF MANUFACTURE

• US 20200263862A1
• Filed: 05/04/2020
• Published: 08/20/2020
• Est. Priority Date: 12/22/2017
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Inventors: BONNE, Ronald
• Granted Patent: US 11,092,321 B2
• Time in Patent Office: Days
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 23/004 arranged on a substrate, e.g. a printed circuit board
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/50 Cooling arrangements air-treatment systems dissipating or using the heat of lighting fixtures F24F3/056
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/10 Controlling the intensity of the light
• CPC Class Codes: H05B 45/12 using optical feedback
• CPC Class Codes: H05B 45/18 using temperature feedback
• CPC Class Codes: H05B 45/325 Pulse-width modulation [PWM]
• CPC Class Codes: H05B 45/37 Converter circuits
• CPC Class Codes: H05B 47/18 via data-bus transmission
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1025 : Metallic discs small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 2201/10568 : Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 7/20509 : Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

Claims

1. A system comprising:

a thermally conductive plate;

a plurality of light-emitting devices (LEDs) on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate and including first electrical power contacts on the surface; and

an electronics board having second electrical power contacts,

the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

2. The system of claim 1, wherein the plurality of LEDs on the surface of the substrate comprise a chip-on-board (COB) LED.

3. The system of claim 1, wherein the thermally conductive plate defines an opening and the substrate is disposed in the opening in the thermally conductive plate.

4. The system of claim 3, wherein the substrate and the opening are the same shape and substantially the same size.

5. The system of claim 1, wherein the electronics board covers the entire surface of the substrate except for a region covered by the plurality of LEDs.

6. The system of claim 1, wherein the thermally conductive plate and the electronics board are circular in shape and 15 mm in diameter.

7. The system of claim 1, wherein the electronics board is 7 mm in height.

8. The system of claim 1, wherein the electronics board further defines an opening, and the plurality of LEDs at least partially protrude into the opening.

9. The system of claim 8, wherein the plurality of LEDs are disposed in a ring on the substrate, and the ring is in contact with the electronics board within the opening.

10. A system comprising:

a plurality of light-emitting device (LED) sub-systems, each of the plurality of LED sub-systems comprising;

a thermally conductive plate,

a plurality of LEDs on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate and including first electrical power contacts on the surface, and

an electronics board having second electrical power contacts, a dimmer interface circuit and a direct current (DC) voltage interface configured to receive a DC voltage from a single external DC power supply,

the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together.

11. The system of claim 10, wherein the thermally conductive plate and the electronics board are circular in shape and 15 mm in diameter.

12. The system of claim 10, wherein the electronics board is 7 mm in height.

13. The system of claim 10, wherein the electronics board at least partially covers the surface of the substrate on which the plurality of LEDs is disposed.

14. The system of claim 10, wherein the electronics board further defines an opening, and the plurality of LEDs at least partially protrude into the opening.

15. The system of claim 10, wherein the plurality of LEDs on the surface of the substrate comprise a chip-on-board (COB) LED.

16. The system of claim 10, wherein the plurality of LEDs is disposed in a ring on the substrate, and the ring is in contact with the electronics board within the opening.

17. The system of claim 10, wherein the electronics board covers the entire surface of the substrate except for a region covered by the plurality of LEDs.

18. The system of claim 10, wherein the thermally conductive plate defines an opening and the substrate is disposed in the opening in the thermally conductive plate.

19. The system of claim 18, wherein the substrate and the opening are the same shape and substantially the same size.