Adhesive composition
First Claim
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1. A METHOD FOR BONDING POLYSTYRENE SURFACES COMPRISING WETTING THE SAID SURFACES WITH A FLUID ADHESIVE COMPOSITION WHICH COMPRISES A SOLVENT FOR POLYSTYRENE SOLIDS, POLYSTYRENE SOLIDS DISSOLVED THEREIN, AND A DILUENT WHICH IS A MEMBER OF A CLASS CONSISTING OF CYCLOHEXANE AND METHYLCYCLOHEXANE AND ETHYLENE GLYCOL MONOMETHYL ETHER AND PLACING THE WETTED SURFACES INTO CONTACT TO THEREBY EFFECT BONDING OF SAID SURFACES.
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1 Claim
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1. A METHOD FOR BONDING POLYSTYRENE SURFACES COMPRISING WETTING THE SAID SURFACES WITH A FLUID ADHESIVE COMPOSITION WHICH COMPRISES A SOLVENT FOR POLYSTYRENE SOLIDS, POLYSTYRENE SOLIDS DISSOLVED THEREIN, AND A DILUENT WHICH IS A MEMBER OF A CLASS CONSISTING OF CYCLOHEXANE AND METHYLCYCLOHEXANE AND ETHYLENE GLYCOL MONOMETHYL ETHER AND PLACING THE WETTED SURFACES INTO CONTACT TO THEREBY EFFECT BONDING OF SAID SURFACES.
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Current AssigneeRobert J. Phair
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Original AssigneeRobert J. Phair
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InventorsPhair, Robert J.
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Application NumberUS03/626,269Time in Patent Office1,533 DaysField of SearchUS Class Current156/334CPC Class CodesC08J 2325/06 PolystyreneC08J 5/125 Adhesives in organic diluentsC08L 2666/28 Non-macromolecular organic ...C09J 125/06 Polystyrene
