Bonding of semiconductor devices to substrates

• US 3,316,628 A
• Filed: 12/30/1964
• Issued: 05/02/1967
• Est. Priority Date: 12/30/1964
• Status: Expired due to Term

• Current Assignee: George F. Lang Jr
• Original Assignee: George F. Lang Jr
• Inventors: Lang, George F. Jr.
• Application Number:
  US04/422,404
• Time in Patent Office: 853 Days
• US Class Current: 228/121
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: Y10S 428/929 : Electrical contact feature
• CPC Class Codes: Y10S 428/934 : Electrical process
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 428/12528 : Semiconductor component
• CPC Class Codes: Y10T 428/12674 : Ge- or Si-base component
• CPC Class Codes: Y10T 428/12889 : Au-base component

Abstract

1,079,323. Silicon - ceramic seals; soldering. UNITED AIRCRAFT CORPORATION. Dec. 14, 1965 [Dec. 30, 1964], No. 53119/65. Headings B3R and B3V. A silicon semi-conductor is bonded to a ceramic substrate by depositing a gold film on the substrate, positioning the semi-conductor on the film, and heating the assembly to form a gold-silicon eutectic. The assembly can be subjected to pressure and agitation while heated to a temperature of 425‹ C. Alternatively, a jet of hydrogen at 450‹ C. can be impinged on the assembly after heating the assembly to 300‹ C. Both the substrate and silicon can be cleaned prior to bonding by agitating them ultrasonically in an alcohol solution, the semi-conductor then being placed in a hydrofluoric acid bath.

Claims

1. A METHOD FOR THE BONDING OF SILICON TO A CERAMIC COMPRISING:

DEPOSITING A GOLD FILM ON A SURFACE OF A CERAMIC BODY, PLACING A SILICON CHIP ON THE DEPOSITED GOLD FILM, AND RAISING THE TEMPERATURE OF THE ASSEMBLY TO THE EXTENT NECESSARY FOR THE FORMATION OF A GOLD-SILICON EUTECTIC.