FLUID ACTUATED CONTACTOR

• US 3,596,228 A
• Filed: 05/29/1969
• Issued: 07/27/1971
• Est. Priority Date: 05/29/1969
• Status: Expired due to Term

• Current Assignee: Frank W. Reed Jr, William J. Ryan
• Original Assignee: Frank W. Reed Jr, William J. Ryan
• Inventors: Reed, Frank W. Jr., Ryan, William J.
• Application Number:
  US04/828,905
• Time in Patent Office: 789 Days
• US Class Current: 439/513
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: H01H 3/24 using pneumatic or hydraulic actuator for storing energy in a spring motor H01H3/301
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

A constant impedance or impedance matched fluid actuated contactor for electrical components, especially integrated circuit semiconductor chips, is provided. The contactor has a flexible dielectric membrane, on one side of which is a resilient, electrically conductive ground plane. On the other side of the dielectric membrane is a plurality of electrically conductive lines adapted to contact the electrical component. The membrane is mounted on a pressure chamber, and a pressurized fluid is utilized to move the dielectric membrane and the electrically conductive lines carried thereon into contacting engagement with the electrical component.

Claims

1. A contactor for an electrical component comprising:

a. a flexible dielectric membrane, b. a plurality of electrically conductive lines on one side of said dielectric membrane and adapted to contact said electrical component, c. a resilient, electrically conductive ground plane on the other side of said dielectric membrane, formed to move with said membrane and covering the ground plane side of said membrane along said electrically conductive lines, and d. fluid pressure-applying means operatively engaging said flexible dielectric membrane from the ground plane side to urge said electrically conductive lines into contacting engagement with said electrical component.

2. a resilient electrically conductive ground plane disposed on said dielectric membrane inside said chamber, and

3. The contactor of claim 1 in which said fluid pressure-applying means comprises a liquid coolant and means for applying pressure to the coolant.

4. The conductor of claim 1 additionally comprising:

e. at least one circuit element mounted on said flexible dielectric membrane and electrically connected to at least one of said plurality of electrically conductive lines.

5. A contactor for a semiconductor chip comprising:

a. a pressure chamber having a cover comprising;

6. The contactor of claim 5 in which said fluid is air.

7. The contactor of claim 5 in which the fluid is a liquid coolant.

8. The contactor of claim 5 additionally comprising:

g. at least one circuit element mounted on the flexible dielectric membrane and electrically connected to at least one of the plurality of electrically conductive lines.

9. A contactor for a semiconductor chip having a plurality of contact pads comprising:

a. a flexible dielectric membrane, b. a resilient, electrically conductive ground plane on one side of said dielectric membrane, c. a plurality of electrically conductive lines on the other side of said dielectric membrane and having recesses at end portions of at least some of said plurality of electrically conductive lines into which said contact pads may rest for automatically positioning said semiconductor chip in contacting relationship with at least some of said plurality of electrically conductive lines, and d. fluid pressure-applying means operatively engaging said flexible dielectric membrane from the ground plane side to urge said electrically conductive lines into contacting engagement with said contact pads.

10. A contactor for an electrical component comprising:

a. a flexible dielectric membrane, b. a resilient, electrically conductive ground plane on one side of said dielectric membrane, c. a plurality of electrically conductive lines on the other side of said dielectric membrane and adapted to contact said electrical component, d. fluid pressure-applying means operatively engaging said flexible dielectric membrane from the ground plane side to urge said electrically conductive lines into contacting engagement with said electrical component, and e. at least one semiconductor chip mounted on said flexible dielectric membrane and electriCally connected to at least one of said plurality of electrically conductive lines.

11. A contactor for an electrical component comprising:

a. a first flexible dielectric membrane, b. a resilient, electrically conductive ground plane on one side of said dielectric membrane, c. a plurality of electrically conductive lines on the other side of said dielectric membrane and adapted to contact said electrical component, d. fluid pressure-applying means operatively engaging said flexible dielectric membrane from the ground plane side to urge said electrically conductive lines into contacting engagement with said electrical component, e. a second flexible dielectric membrane on the other side of said ground plane from said first flexible dielectric membrane, and f. an electrically conductive line on the other side of said second flexible dielectric membrane from said ground plane and having a terminal portion passing through said second flexible dielectric membrane, said ground plane and said first flexible dielectric membrane, the terminal portion being adapted to engage said electrical component.

12. A contactor for a semiconductor chip having a plurality of contact pads comprising:

a. a pressure chamber having a cover comprising;