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LAMINATED STRUCTURES AND METHOD OF FORMING THE SAME

  • US 3,816,201 A
  • Filed: 02/22/1973
  • Issued: 06/11/1974
  • Est. Priority Date: 03/26/1970
  • Status: Expired due to Term
First Claim
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2. The method of claim 1 wherein in step C a second interlayer film is interposed between one of said plies and the exposed surface of said carrier film prior to lamination of said plies to said structure.

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