Process for encapsulating electronic components in plastic

  • US 4,043,027 A
  • Filed: 07/30/1973
  • Issued: 08/23/1977
  • Est. Priority Date: 12/16/1963
  • Status: Expired due to Term
First Claim
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1. A process for encapsulating a miniaturized semiconductor device having a multiplicity of electrical terminals comprising the steps of:

  • electrically connecting each of the electrical terminals of the device to an intermediate point of a conductor and mechanically attaching each component of the device to at least one of the conductors for support,disposing the device and the adjacent intermediate portions of the conductors in a mold cavity with the opposite ends of each of the conductors extending from generally opposite sides of the mold cavity, andholding the opposite ends of the conductors extending from the mold cavity while injecting a fluid insulating material into the mold cavity which will subsequently solidify, the fluid insulating material being injected into a portion of the mold cavity remote from the device and the means electrically connecting the terminals of the device to the conductors,whereby the fluid will not directly engage the device and electrical connection means at a high velocity and the conductors will be secured against appreciable displacement by the fluid which would be likely to break or displace a connection means in such a manner to cause a failure of the device.

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