Machine for changing the spacing of a plurality of wafers

• US 4,108,323 A
• Filed: 09/28/1977
• Issued: 08/22/1978
• Est. Priority Date: 09/28/1977
• Status: Expired due to Term

• Current Assignee: RCA Corporation
• Original Assignee: RCA Corporation
• Inventors: Shambelan, Robert Charles, Lindsley, Charles Wesley
• Primary Examiner(s): Sheridan, Robert G.
• Application Number:
  US05/837,419
• Time in Patent Office: 328 Days
• Field of Search: 214/16.6, 214/301, 214/309, 214/310, 214/1 R, 221/DIG. 1, 221/134, 211/135, 211/207, 211/208, 211/209, 53/152, 53/153, 53/166, 198/456, 198/458, 198/459
• US Class Current: 414/416.02
• CPC Class Codes: B65G 65/00 Loading or unloading of vehicles B65G67/00
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette

Abstract

A machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith.

Claims

1. A machine comprising:

a plurality of wafer receiving surfaces, said wafer receiving surfaces initially having a first spacing associated therewith;

a base having a top surface above which said wafer receiving surfaces extend,

each said wafer receiving surface being at a different height above said top surface than every other wafer receiving surface; and

means cooperatively engaged with said surfaces for changing said first spacing to a second spacing.

2. A machine as claimed in claim 1 wherein each said wafer receiving surface further comprises:

means for disengaging a wafer from a wafer cartridge.

3. A machine as claimed in claim 2 wherein:

said disengaging means is a ridge projecting from a back edge of each of said wafer receiving surface.

4. A machine as claimed in claim 1 wherein:

said wafer receiving surfaces are aligned in a single row according to height.

5. A machine as claimed in claim 4 wherein:

said wafer receiving surfaces are positioned in an overlapping fashion.

6. A machine as claimed in claim 1 wherein:

each wafer receiving surface is supported by a shank which movably contacts said space changing means.

7. A machine as claimed in claim 6 wherein said space changing means comprises:

a control arm pivotally connected to a base having a top surface above which said wafer receiving surfaces extend;

said control arm being contacted by said shanks; and

an eccentric cam rotatably engaged with said base and contacting said control arm whereby said control arm pivots when said cam is rotated.

8. A machine as claimed in claim 7 further comprising:

means for securing contact between said shanks and said control arm.

9. A machine as claimed in claim 1 further comprising:

means for adjusting said first spacing.