Method of mounting integrated circuit chips on a substrate and apparatus for carrying out the method
First Claim
1. A method of mounting on a substrate which is provided with at least one set of connecting areas arranged in a predetermined configuration about a center, at least one integrated circuit chip which has previously been mounted on a flexible support of inextensible insulating material, the said chip being provided with connecting conductors which are attached to the said flexible support and extend from the edges of the chip, comprising the steps of:
- positioning the support containing the chip on a support carrier,placing the support carrier in a cutting tool having a cutting head movable along a working axis and a cutting die arranged in the path of the said head, in such a way that the center of the chip is placed over the die and is aligned with said working axis,placing the substrate on a support block movable in a direction perpendicular to the said working axis, initially positioning the support block such that a reference on said support block is aligned in predetermined positions with respect to a fixed positioning axis parallel to the said working axis,shifting the substrate with respect to the support block to cause the center of a set of connecting areas on the substrate to coincide with the said fixed positioning axis,moving the support block to bring the substrate under the cutting tool such that the reference means occupies the same position with respect to the working axis of the said tool as occupied with respect to the positioning axis,actuating the cutting tool to cause the cutting head, in the course of its movement, to cut through the connecting conductors of the chip which has been positioned on the cutting die, carrying the chip thus separated from its support along by the head and positioning said separated chip against the substrate,raising the head clear of the die and after the head has been so raised, moving the support block to bring the substrate under a soldering head movable along a working axis parallel to the positioning axis, in such a way that the reference means occupy the same position with respect to the working axis of the soldering head as occupied with respect to the positioning axis,actuating the soldering head to press against the connecting areas on the substrate the portions of the connecting conductors, remaining on the chip which has been positioned against the substrate, supplying power to the head to cause the said portions to be soldered to the said areas, and returning the soldering head to its initial position.
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Abstract
Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support. A soldering tool is provided consisting of a soldering head movable along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, along with a positioning assembly whose positioning axis is parallel to the working axes and passes through a third fixed point on the path followed by the support block.
The substrate is shifted with respect to the support block to cause the center of a set of connecting areas to coincide with the said positioning axis, and the support block is locked in position under the cutting tool and then under the soldering tool in such a way that a reference on the said support block successively occupies, with respect to the respective working axis of the two tools, the same positions as occupied with respect to the positioning axis. Finally, actuating means are included to control the movements of the cutting and soldering heads.
43 Citations
18 Claims
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1. A method of mounting on a substrate which is provided with at least one set of connecting areas arranged in a predetermined configuration about a center, at least one integrated circuit chip which has previously been mounted on a flexible support of inextensible insulating material, the said chip being provided with connecting conductors which are attached to the said flexible support and extend from the edges of the chip, comprising the steps of:
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positioning the support containing the chip on a support carrier, placing the support carrier in a cutting tool having a cutting head movable along a working axis and a cutting die arranged in the path of the said head, in such a way that the center of the chip is placed over the die and is aligned with said working axis, placing the substrate on a support block movable in a direction perpendicular to the said working axis, initially positioning the support block such that a reference on said support block is aligned in predetermined positions with respect to a fixed positioning axis parallel to the said working axis, shifting the substrate with respect to the support block to cause the center of a set of connecting areas on the substrate to coincide with the said fixed positioning axis, moving the support block to bring the substrate under the cutting tool such that the reference means occupies the same position with respect to the working axis of the said tool as occupied with respect to the positioning axis, actuating the cutting tool to cause the cutting head, in the course of its movement, to cut through the connecting conductors of the chip which has been positioned on the cutting die, carrying the chip thus separated from its support along by the head and positioning said separated chip against the substrate, raising the head clear of the die and after the head has been so raised, moving the support block to bring the substrate under a soldering head movable along a working axis parallel to the positioning axis, in such a way that the reference means occupy the same position with respect to the working axis of the soldering head as occupied with respect to the positioning axis, actuating the soldering head to press against the connecting areas on the substrate the portions of the connecting conductors, remaining on the chip which has been positioned against the substrate, supplying power to the head to cause the said portions to be soldered to the said areas, and returning the soldering head to its initial position. - View Dependent Claims (2, 3)
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4. Apparatus for mounting, on a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center, at least one integrated circuit chip which has been previously mounted on a flexible support of inextensible insulating material, the said chip being provided with connecting conductors which are attached to the said flexible support and extend from the edges of the chip, comprising, in combination:
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a support block movable horizontally along a predetermined path, said support block being provided with reference means and beng adapted to receive thereon a substrate provided with at least one set of connecting areas which are arranged in a predetermined configuration about a center, a cutting tool consisting on the one hand of a cutting head moveable along a working axis perpendicular to the path followed by the support block and which passes thorugh a first fixed point on the said path, and on the other hand of a cutting die arranged in the path of the said head, said cutting die being adapted to receive an integrated circuit chip mounted on the flexible support, a soldering tool including a soldering head movble along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, a positioning assembly having a positioning axis parallel to the said working axes and which passes through a third fixed point on the path followed by the suport block, means for shifting the substrate with respect to the support block to cause the center of a set of connecting areas on the substrate to coincide with the said positioning axis, locking means to position the support block under the cutting tool and then under the soldering tool in such a way that the reference means of the said support block successively occupy, with respect to the respective working axis of the two tools, the same positions as they occupied with respect to the positioning axis, the actuating means to control the movements of the cutting and soldering heads. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification